Automotive PCB Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Vehicle Type (Passenger Car and Commercial Vehicle), By Propulsion Type (IC Engine and Electric), By Regional, By Competition 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 10.59 Billion
CAGR (2026-2031)	6.81%
Fastest Growing Segment	IC Engine
Largest Market	Asia Pacific
Market Size (2031)	USD 15.72 Billion

Market Overview

The Global Automotive PCB Market will grow from USD 10.59 Billion in 2025 to USD 15.72 Billion by 2031 at a 6.81% CAGR. Automotive Printed Circuit Boards (PCBs) function as the essential mechanical support and electrical interconnects for electronic components within vehicles, utilized in systems ranging from engine control units to advanced infotainment and safety features. The market is primarily propelled by the rapid electrification of the automotive sector, which necessitates high-power and thermal-resistant boards for electric vehicle powertrains and battery management systems. Furthermore, the extensive integration of Advanced Driver Assistance Systems (ADAS) and autonomous driving technologies drives the demand for high-density interconnect and flexible PCBs capable of supporting complex computing requirements.

According to the Taiwan Printed Circuit Association, in 2024, the automotive sector accounted for approximately 26.9% of the PCB application market in Mainland China, underscoring the segment's pivotal role within the largest global production hub for electronics. Despite this robust demand, the market faces a significant challenge regarding supply chain volatility and raw material shortages, particularly for copper and high-performance laminates. These disruptions, often exacerbated by geopolitical tensions, can lead to extended lead times and increased production costs, potentially impeding the seamless delivery of critical components required for modern vehicle assembly.

Key Market Drivers

Accelerating global vehicle electrification serves as the primary catalyst for market expansion, fundamentally altering the requirements for printed circuit boards (PCBs). As manufacturers transition from internal combustion engines to electric powertrains, the industry requires robust, high-voltage PCBs to manage battery management systems (BMS) and power inverters. These components demand boards with thick copper configurations and superior thermal management properties to effectively handle high currents. This shift is evidenced by the massive scale of adoption in major production hubs. According to the China Passenger Car Association, in January 2025, retail sales of new energy passenger vehicles in China reached 10.98 million units for the full year 2024, representing a 42% year-on-year increase. Additionally, the European Automobile Manufacturers’ Association reported in November 2025 that battery-electric cars captured 16.4% of the EU market share year-to-date, underscoring the sustained global momentum of electrification.

The rising integration of Advanced Driver-Assistance Systems (ADAS) is simultaneously reshaping the sector’s technological landscape. This trend drives a critical migration toward High-Density Interconnect (HDI) and flexible PCB architectures, which are essential for supporting the miniaturization and high-speed signal transmission required by LIDAR, radar, and camera modules. These advanced boards enable the dense component placement necessary for real-time data processing units within zonal vehicle architectures. The industrial impact of this technological evolution is profound. According to the Taiwan Printed Circuit Association, in March 2025, in its industry production report, the demand for HDI boards among Taiwanese manufacturers grew by 20.1% in 2024, a surge largely attributed to automotive electronics requirements. This data highlights how the push for enhanced vehicle safety is directly translating into higher value-add manufacturing opportunities within the supply chain.

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Key Market Challenges

The instability of the supply chain and the scarcity of critical raw materials, particularly copper and high-performance laminates, act as a primary restraint on the expansion of the Global Automotive PCB Market. These disruptions sever the reliability of production schedules, creating significant bottlenecks that prevent manufacturers from capitalizing on the rising demand for electric and autonomous vehicles. When essential printed circuit boards are unavailable due to material shortages, automotive assemblers are forced to halt production lines, which directly limits revenue realization and slows the broader adoption of advanced automotive technologies.

This operational strain is substantiated by recent industrial data indicating persistent input challenges. According to the IPC, in December 2024, 45% of electronics manufacturers reported rising material costs, reflecting the ongoing difficulty in securing affordable and consistent resources. Such volatility forces PCB fabricators to extend lead times and increase prices, passing the burden onto automotive OEMs. Consequently, the market struggles to maintain the consistent output levels required to support the rapid pace of vehicle electrification, directly dampening the sector's overall growth potential.

Key Market Trends

The integration of high-frequency substrates for 5G and V2X (Vehicle-to-Everything) connectivity is emerging as a critical trend, distinct from standard computing requirements. As automakers deploy cooperative intelligent transport systems, there is a surging demand for specialized printed circuit boards capable of minimizing signal loss at millimeter-wave frequencies. These low-loss materials are essential for enabling real-time communication between vehicles and infrastructure, a capability that standard FR-4 laminates cannot reliably support in high-bandwidth environments. The scale of this connectivity shift is massive, necessitating a rapid evolution in material selection by PCB fabricators. According to the 5G Automotive Association (5GAA), in December 2024, in its ‘Roadmap for Advanced Driving Use Cases, Connectivity, and Technologies’, the number of cellular-connected vehicles on the road reached more than 300 million globally, highlighting the immediate need for infrastructure-ready board solutions.

Simultaneously, the development of eco-friendly and recyclable PCB materials is reshaping manufacturing strategies to meet stringent environmental regulations and corporate sustainability goals. Manufacturers are increasingly moving away from traditional, hard-to-recycle thermoset plastics toward biodegradable substrates and thermoplastic materials that allow for easier component reclamation at the end of a vehicle's life cycle. This transition is driven not only by regulatory pressure but also by the potential for long-term operational efficiencies in the supply chain. This strategic pivot is substantiated by industry sentiment; according to the IPC, in March 2025, in a survey of the global electronics industry, 58% of electronics leaders identified cost saving and operational efficiency as key motivators for accelerating their sustainability efforts, confirming that green manufacturing has become a central competitive priority.

Segmental Insights

According to trusted market research, the IC Engine segment is distinguished as the fastest-growing category in the Global Automotive PCB Market. This rapid expansion is propelled by the critical need to modernize combustion powertrains with advanced electronics to comply with stringent emission regulations and fuel efficiency standards. Manufacturers are heavily integrating complex Printed Circuit Boards into Engine Control Units and transmission systems to satisfy rigorous environmental mandates. Consequently, the drive to optimize traditional engine performance through increased electronic content is significantly accelerating demand within this specific segment.

Regional Insights

Asia Pacific maintains a leading position in the Global Automotive PCB Market, primarily driven by its established capacity as the world's largest automotive manufacturing hub. The region benefits significantly from the rapid expansion of electric vehicle production in China and Japan, which necessitates higher volumes of electronic integration. Additionally, supportive government policies promoting new energy vehicles and strict safety regulations continue to accelerate the adoption of advanced driver-assistance systems. This consistent demand, supported by a robust local supply chain and readily available raw materials, solidifies Asia Pacific as the central contributor to market development.

Recent Developments

• In July 2025, Syrma SGS Technology announced a strategic collaboration with Shinhyup Electronics to establish a large-scale printed circuit board manufacturing facility in Andhra Pradesh, India. The project involves a substantial investment of ₹1,800 crore to create capacity for producing multi-layer boards and copper-clad laminates. These components are critical for key verticals such as automotive systems and electric mobility, as well as industrial and medical applications. This joint venture aims to leverage advanced manufacturing technologies to serve the domestic and international markets, significantly boosting the region's role in the global electronic component ecosystem.
• In December 2024, Meiko Electronics Vietnam Co., Ltd. confirmed an additional investment of $300 million to expand its production capabilities in Hanoi. This capital injection is designated for the construction of a fourth factory within the Thach That-Quoc Oai Industrial Park, which will focus on manufacturing high-tech printed circuit boards. The new facility is expected to produce plated through-hole and flexible circuits, directly supporting the rising demand for sophisticated automotive electronics and other high-performance devices. This expansion raises the company's total investment in the project to $800 million, reinforcing its position in the global supply chain.
• In June 2024, Schweizer Electronic AG entered into a strategic partnership with Zollner Elektronik AG to advance the industrialization of power embedding technology. The collaboration focuses on the p² Pack® solution, which integrates silicon carbide chips directly into printed circuit boards to improve performance in high-power applications. This technology is particularly relevant for the automotive market, addressing the need for efficient direct current to alternating current conversion in electric vehicles. The alliance combines the company's expertise in chip embedding with the partner's manufacturing capabilities, aiming to accelerate market adoption and provide enhanced design-in support for global clients.
• In May 2024, CMK Corporation announced the completion of its new manufacturing facility in Thailand, marking a significant milestone in its expansion strategy. This development is part of the company's broader initiative to capture growing demand in the automotive sector, specifically for "CASE" (Connected, Autonomous, Shared, and Electric) technologies. The new plant is designed to enhance production capacity for high-reliability printed circuit boards used in vehicle powertrains and driving safety systems. By strengthening its overseas manufacturing base, the company aims to diversify its supply chain and better serve global automotive customers with advanced electronic components.

Key Market Players

• Infineon Technologies AG
• Samsung Electro Mechanics
• CMK Corporation
• Amitron Corporation
• KCE Group
• Deaduck Phil. Inc.
• MEIKO ELECTRONICS Co., Ltd.
• CHIN POON Industrial Co., Ltd.
• Unimicron Group
• STMicroelectronics N.V.

By Vehicle Type	By Propulsion Type	By Region
Passenger Car and Commercial Vehicle	IC Engine and Electric	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Automotive PCB Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Automotive PCB Market, By Vehicle Type:

• Passenger Car and Commercial Vehicle

• Automotive PCB Market, By Propulsion Type:

• IC Engine and Electric

• Automotive PCB Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE