Dicing & Backgrinding Tapes Market is Expected to grow at a robust CAGR of 6.73% through 2030F
The Dicing and Backgrinding Tapes market
is increasing due to rising demand for compact, high-performance semiconductors
in advanced electronic devices during the forecast period 2026-2030F.
According to TechSci Research report, “Dicing & Backgrinding Tapes
Market – Global Industry Size, Share, Trends, Competition Forecast &
Opportunities, 2030F”, The Global Dicing & Backgrinding Tapes Market
was valued at USD 2.12 Billion in 2024 and is expected to reach USD 3.16 Billion by 2030 with a CAGR of 6.73% during the forecast period.
The automotive industry’s rapid
transformation toward intelligent mobility, autonomous driving, and
electrification is significantly expanding the usage of semiconductors in
modern vehicles. Applications such as electric powertrains, battery management
systems, advanced driver-assistance systems, infotainment, and
vehicle-to-everything communication demand complex and high-performance chips,
many of which are manufactured using advanced wafer processing techniques.
These integrated circuits must be
durable, reliable, and compact, given the harsh operating environments in
automobiles. Dicing and backgrinding tapes support this requirement by
safeguarding wafer integrity during manufacturing, enabling defect-free die
singulation and high-yield wafer thinning. Furthermore, as the automotive
sector increasingly adopts wide bandgap semiconductors like silicon carbide and
gallium nitride for power electronics, the demand for protective tape solutions
tailored to these brittle substrates continues to grow.
As electric vehicles become mainstream
and embedded control systems proliferate, the volume of semiconductor content
per vehicle is set to rise substantially. This trend will positively influence
the Dicing and Backgrinding Tapes Market, as semiconductor manufacturers must
scale up their processing capabilities while maintaining quality and yield
metrics through the use of effective protective tapes.
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Dicing & Backgrinding Tapes Market"
Based on Material, Polyvinyl Chloride,
commonly known as Polyvinyl Chloride (PVC), has emerged as the fastest-growing
material segment in the global Dicing and Backgrinding Tapes market. This
accelerated growth is attributed to its unique blend of functional
characteristics that align well with the evolving demands of semiconductor
manufacturing processes. Polyvinyl Chloride (PVC) offers excellent adhesive
properties, consistent thermal stability, and superior mechanical strength,
which are critical for protecting delicate semiconductor wafers during dicing
and backgrinding operations. As semiconductor designs become increasingly
complex and miniaturized, the demand for highly reliable and versatile tape
materials has surged. Polyvinyl Chloride (PVC) fulfills these requirements by
delivering strong wafer protection, minimizing contamination, and reducing the
risks of delamination, thereby improving overall yield and processing
efficiency.
The growing shift toward automation and
high-throughput manufacturing in semiconductor fabrication plants has further
intensified the demand for dependable, cost-efficient materials like Polyvinyl
Chloride (PVC). Manufacturers prefer Polyvinyl Chloride (PVC)-based tapes due
to their compatibility with diverse processing environments and ability to
withstand mechanical stress and chemical exposure. Moreover, Polyvinyl Chloride
(PVC) offers a balance between performance and affordability, making it particularly
attractive for both advanced and conventional semiconductor applications.
Increased semiconductor consumption
across consumer electronics, automotive electronics, and communication
devices—especially in emerging markets such as China, India, and Southeast
Asia—has propelled the usage of Polyvinyl Chloride (PVC) tapes. The material’s
scalability and adaptability to various wafer sizes and thicknesses further
enhance its position as a preferred choice among semiconductor manufacturers.
As new fabrication facilities are established to meet the global demand for
integrated circuits and sensors, the need for robust dicing and backgrinding
solutions using Polyvinyl Chloride (PVC) is expected to remain on a sharp
upward trajectory, reinforcing its status as the fastest-growing segment in
this material category.
Based on region, North America has emerged as the fastest-growing
region in the global Dicing and Backgrinding Tapes market, driven by a
combination of advanced semiconductor manufacturing capabilities, rising
investments in fabrication infrastructure, and the presence of leading
technology firms. The region is home to several major semiconductor
manufacturers and foundries that are aggressively expanding their production
capacities to meet the growing demand for high-performance chips used in
artificial intelligence, autonomous vehicles, cloud computing, and
next-generation telecommunications. This surge in semiconductor activity has
created significant demand for high-quality dicing and backgrinding tapes that
ensure wafer integrity and yield during precision processing.
Government initiatives and strategic funding aimed at
revitalizing domestic chip production have also contributed to the region’s
accelerated growth. Programs such as the CHIPS and Science Act in the United
States, which allocates substantial financial incentives to support
semiconductor research and manufacturing, are bolstering infrastructure
development and encouraging partnerships between public institutions and
private enterprises. These initiatives not only support the expansion of
fabrication plants but also stimulate demand for supporting materials like
dicing and backgrinding tapes.
The presence of research-intensive universities and
innovation-driven start-ups in the region fosters a robust ecosystem for
semiconductor material development. Companies in North America are at the
forefront of innovating wafer processing technologies, and the increasing trend
toward thin wafer processing and chip stacking further amplifies the need for
advanced tapes with excellent adhesion, low contamination risk, and high
thermal resistance.
The region's focus on achieving self-reliance in
semiconductor manufacturing, coupled with consistent technological advancements
and robust capital investments, is positioning North America as a high-growth
market for dicing and backgrinding tapes. With continued emphasis on domestic
chip production and a dynamic supply chain, North America is expected to
maintain its momentum as the fastest-growing region throughout the forecast
period.
Key market players in the Global Dicing
& Backgrinding Tapes market are: -
- 3M Company
- Nitto Denko Corporation
- Tesa SE.
- Lintec Corporation
- Dow
Inc.
- Semiconductor
Equipment Corporation.
- Kyocera
Corporation
- Singamas
Container Industry Company Limited
- Mitsui
Chemicals, Inc
- Fujifilm Corporation.
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“The Dicing and Backgrinding Tapes
market is projected to witness steady growth in the coming years, driven by the
increasing demand for compact and high-performance electronic devices across
consumer electronics, automotive, and industrial sectors. The rapid adoption of
advanced semiconductor technologies, such as three-dimensional integrated
circuits and system-in-package, will further boost the usage of precision wafer
processing materials. Growing investments in semiconductor manufacturing
facilities, especially in Asia Pacific and North America, along with rising
focus on chip quality and yield enhancement, are expected to propel market
expansion. Innovations in tape materials and automation will also contribute
significantly to future growth.” said Mr. Karan Chechi, Research Director of
TechSci Research, a research-based Global management consulting firm.
“Dicing & Backgrinding Tapes Market - Global Industry Size, Share, Trends, Opportunity, and
Forecast, Segmented By Type (Dicing Tapes, Backgrinding Tapes), By Material (Polyolefin,
Polyvinyl Chloride (PVC), Polyethylene Terephthalate (PET), Others), By
Application (Memory, Logic, MEMS, CMOS Image Sensors, Power Devices, Others), By
Region & Competition, 2020-2030F,”
has evaluated the future growth potential of Global Dicing & Backgrinding
Tapes Market and provides statistics & information on market size,
structure, and future market growth. The report intends to provide cutting-edge
market intelligence and help decision makers take sound investment decisions.
Besides the report also identifies and analyzes the emerging trends along with
essential drivers, challenges, and opportunities in Global Dicing &
Backgrinding Tapes Market.
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