Wi-Fi 6 And Wi-Fi 6E Chipset Market – Global Industry Size, Share, Trends, Opportunity, and Forecast Segmented By Chipset Type (Wi-Fi 6, Wi-Fi 6E), By Device Type (WLAN Infrastructure Device, Smart Home Devices, Wireless Cameras, Industrial IoT Devices, Connected Vehicles, Others), By Application (Residential/Consumer, Commercial), Region, By Competition, 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 20.34 Billion
CAGR (2026-2031)	14.58%
Fastest Growing Segment	Wi-Fi 6
Largest Market	Asia Pacific
Market Size (2031)	USD 46.03 Billion

Market Overview

The Global Wi-Fi 6 And Wi-Fi 6E Chipset Market will grow from USD 20.34 Billion in 2025 to USD 46.03 Billion by 2031 at a 14.58% CAGR. Wi-Fi 6 and Wi-Fi 6E chipsets are semiconductor solutions compliant with the IEEE 802.11ax standard that enable wireless communication across the 2.4 GHz, 5 GHz, and 6 GHz frequency bands. The primary drivers propelling this market include the escalating necessity for consistent high-throughput connectivity in dense commercial environments and the critical requirement for low-latency transmission to support the expanding ecosystem of Internet of Things devices. These fundamental demands necessitate robust hardware capable of managing simultaneous connections efficiently without degrading network performance. According to the Wireless Broadband Alliance, in 2024, 58 percent of industry respondents expressed increased confidence in investing in Wi-Fi technology compared to the previous year.

Despite this positive trajectory, the market faces a significant impediment regarding the global harmonization of radio frequency allocations. Regulatory fragmentation concerning the unlicensed use of the 6 GHz band limits the universal deployment of these technologies and creates regional disparities. This lack of uniformity complicates manufacturing processes and delays the widespread implementation of standard-compliant infrastructure across different geopolitical jurisdictions.

Key Market Drivers

Regulatory approval and utilization of the 6 GHz spectrum for Wi-Fi 6E is the foremost catalyst enabling the next generation of wireless performance. The release of this spectrum band is essential for Wi-Fi 6E chipsets, as it provides the necessary wide-channel bandwidth to alleviate congestion found in legacy 2.4 GHz and 5 GHz bands, thereby unlocking multi-gigabit speeds and deterministic low latency for compatible hardware. This regulatory momentum significantly expands the addressable market for chipset manufacturers by validating the deployment of 6E-capable infrastructure globally. According to RCR Wireless, December 2024, in the 'What is the global status of 6 GHz Wi-Fi?' article, 63 countries have adopted either all or part of the 6 GHz band for unlicensed use, creating a massive footprint for these semiconductor technologies.

The proliferation of Internet of Things (IoT) ecosystems and smart connected devices further accelerates the adoption of advanced Wi-Fi 6 and 6E silicon. As households and industrial environments saturate with high-density client devices ranging from 4K streaming units to latency-sensitive sensors, the demand for chipsets that support Orthogonal Frequency Division Multiple Access (OFDMA) and expanded spectrum becomes critical to maintain network efficiency. This surge in device density directly translates to higher shipment volumes for capable radio components. According to Wi-Fi NOW, April 2025, in the 'Massive market adoption' article, the total number of Wi-Fi 6E devices released reached more than 4,300 models by the end of 2024. Reinforcing this growth sentiment, the broader market outlook remains robust. According to the Wireless Broadband Alliance, in November 2024, 60 percent of industry executives expressed increased confidence in investing in Wi-Fi technologies, signaling sustained demand for the underlying chipset architectures.

Download Free Sample Report

Key Market Challenges

Regulatory fragmentation regarding the unlicensed use of the 6 GHz band acts as a primary constraint on the Global Wi-Fi 6 And Wi-Fi 6E Chipset Market. This lack of global harmonization forces semiconductor manufacturers to navigate a patchwork of frequency allocations, preventing the development of a single, universal hardware design. Instead of streamlining production, vendors must engineer and certify region-specific chipsets to accommodate varying spectrum rules. This requirement increases manufacturing complexity and operational costs while diminishing the economies of scale that are essential for lowering unit prices and accelerating mass market adoption.

The inability to deploy a standardized infrastructure across all geopolitical jurisdictions further creates disparate user experiences, limiting the perceived value of upgrading to newer standards in restrictive regions. The market impact is evident in the uneven accessibility of the spectrum required for optimal performance. According to the Wi-Fi Alliance, in 2024, although more than 60 countries have approved 6 GHz operation, the divide between regions allowing the full 1200 MHz and those permitting only the lower 500 MHz continues to bifurcate the equipment market. This inconsistency directly hampers the ability of chipset vendors to supply a uniform global product, thereby decelerating overall market expansion.

Key Market Trends

The convergence of Wi-Fi 6 and 5G technologies for hybrid connectivity is reshaping the chipset market by driving the deployment of unified network architectures. Service providers are increasingly integrating these standards to ensure seamless interoperability, utilizing features like OpenRoaming to facilitate automatic handovers between cellular and Wi-Fi networks without user intervention. This synergy efficiently offloads data traffic while maintaining carrier-grade security across heterogeneous environments. According to the Wireless Broadband Alliance, December 2024, in the 'WBA Industry Report 2025', 81 percent of industry respondents plan to deploy OpenRoaming by 2026, marking an 18.9 percent increase from the previous year, highlighting the critical role of converged connectivity in infrastructure strategies.

Simultaneously, a shift toward multi-protocol chipsets bundling Wi-Fi with Thread and Matter is accelerating to support the Internet of Things ecosystem. Semiconductor vendors are combining Wi-Fi 6's high throughput with the low-power capabilities of 802.15.4 protocols, enabling single silicon solutions to handle both media transmission and sensor communication. This integration simplifies device design and ensures compliance with the interoperable Matter standard for smart home automation. The scale of this opportunity is significant; according to Nordic Semiconductor, January 2025, in the 'A Vision for Tomorrow's Wireless World' article, global Bluetooth Low Energy chip shipments reached 1.8 billion units in 2024, creating a vast market for companion Wi-Fi 6 integrated circuits in multi-protocol IoT deployments.

Segmental Insights

Based on data from the Wi-Fi Alliance, the Wi-Fi 6 segment represents the fastest-growing category in terms of market adoption within the global chipset industry, outpacing the uptake rates of previous wireless generations. This rapid expansion is primarily driven by the immediate need for efficient network performance in high-density environments, such as smart offices and congested public venues. Unlike the Wi-Fi 6E segment, which relies on the availability of the 6 GHz spectrum, Wi-Fi 6 operates universally across existing bands, ensuring broader compatibility with legacy infrastructure. Consequently, enterprises and consumer electronics manufacturers are prioritizing Wi-Fi 6 chipsets to deliver low latency and improved capacity for the growing ecosystem of connected devices.

Regional Insights

Asia Pacific dominates the Global Wi-Fi 6 and Wi-Fi 6E Chipset Market, largely driven by its established status as a primary manufacturing hub for consumer electronics. Nations such as China, South Korea, and Japan host major semiconductor and device producers, facilitating the rapid integration of advanced connectivity solutions into smartphones and routers. This leadership is reinforced by forward-looking regulatory policies; for instance, the Ministry of Science and ICT in South Korea was the first in the region to allocate the 6 GHz band for unlicensed use. Consequently, strong industrial capabilities combined with supportive spectrum availability sustain the region's market supremacy.

Recent Developments

• In December 2025, Nordic Semiconductor unveiled the nRF7002 Expansion Board II, a specialized hardware tool designed to extend Wi-Fi 6 capabilities to its nRF54L Series development kits. This plug-in module enables developers to seamlessly integrate dual-band Wi-Fi 6 connectivity, operating across 2.4 GHz and 5 GHz bands, into ultra-low-power wireless products. The board supports essential standard features like Target Wake Time and OFDMA, which are critical for optimizing battery life in energy-constrained Internet of Things devices. This strategic launch allows the company to accelerate the development and deployment of advanced smart home and industrial sensor applications.
• In June 2025, NXP Semiconductors launched the IW693, a high-performance system-on-chip specifically optimized for industrial Internet of Things applications. This advanced solution features a 2x2 Wi-Fi 6E radio that operates in the 6 GHz spectrum, effectively addressing congestion issues often encountered in legacy network bands. The chipset also incorporates Bluetooth Low Energy Audio capabilities, which enable multiple streams of user-specific content and broadcast audio services. Designed to provide secure, reliable, and low-latency connectivity, this product targets demanding environments such as smart homes and automotive sectors, significantly enhancing the company's wireless connectivity portfolio.
• In January 2025, MediaTek announced a strategic collaboration with Google to develop the MT7903, a new Filogic-branded chipset tailored for the evolving smart home ecosystem. This innovative component integrates tri-band Wi-Fi 6E connectivity, Bluetooth 6, and IEEE 802.15.4 radios into a unified solution. The partnership focuses on facilitating the widespread adoption of Thread technology and enhancing interoperability for Internet of Things devices that support the Matter standard. The companies confirmed that this chipset, designed to offer robust security and seamless connectivity across various protocols, would be ready for sampling in the first half of the year.
• In June 2024, Infineon Technologies introduced the AIROC CYW5591x family of connected microcontrollers, effectively combining Wi-Fi 6 and Wi-Fi 6E connectivity with Bluetooth Low Energy 5.4 in a single component. These sophisticated chips utilize a powerful Arm Cortex-M33 processor and are engineered to deliver extended wireless range while maintaining exceptional power efficiency. The product line addresses the needs of diverse sectors, including smart homes, industrial automation, and wearables, by offering a cost-optimized and secure platform. The company emphasized that this release fully supports the Matter standard, thereby simplifying the development process for manufacturers creating interoperable smart devices.

Key Market Players

• Qualcomm Incorporated
• Broadcom Inc.
• Intel Corporation
• MediaTek Inc.
• Cisco Systems, Inc.
• Huawei Technologies Co., Ltd.
• TP-Link Technologies Co., Ltd.
• NETGEAR, Inc.

By Chipset Type	By Device Type	By Application	By Region
Wi-Fi 6 Wi-Fi 6E	WLAN Infrastructure Device Smart Home Devices Wireless Cameras Industrial IoT Devices Connected Vehicles Others	Residential/Consumer Commercial	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Wi-Fi 6 And Wi-Fi 6E Chipset Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Chipset Type:

• Wi-Fi 6
• Wi-Fi 6E

• Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Device Type:

• WLAN Infrastructure Device
• Smart Home Devices
• Wireless Cameras
• Industrial IoT Devices
• Connected Vehicles
• Others

• Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Application:

• Residential/Consumer
• Commercial

• Wi-Fi 6 And Wi-Fi 6E Chipset Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE