Vietnam LED Packaging Market is predicted to grow at a robust CAGR by 2023, owing to the rising need for adopting LEDs over traditional incandescent lamps to conserve energy and the growing use of high grade and smart LED Packages across various end-use industries. Moreover, the increasing government initiatives to adopt smart, efficient and energy saving LED lights over conventional sources will propel the growth of Vietnam LED Packaging market. Based on package type segment of the LED Packaging market, Chip Scale Package (CSP) is predicted to lead the market in the next five years, due to its advantages like thinner profile, compact package footprint, reduced weight and better electrical performance etc over others. Based on the applications, general lightning segment is anticipated to occupy the largest market share in the forecast period due to the increasing need of cost-effective and energy saving lighting in residential and commercial areas.

Years considered for this report:

Historical Years: 2013-2016

Base Year: 2017

Estimated Year: 2018

Forecast Period: 2018–2023

Objective of the Study:

  • To analyse and forecast the market size of LED Packaging Market, in terms of value.
  • To classify and forecast Vietnam LED Packaging Market based on package type, packaging material, applications and regional distribution.
  • To identify drivers and challenges for Vietnam LED Packaging Market.
  • To examine competitive developments such as expansions, mergers & acquisitions, etc., in Vietnam LED Packaging Market.
  • To conduct the pricing analysis for LED Packaging Market.
  • To identify and analyse the profile of leading players involved in the manufacturing of Vietnam LED Packaging Market.

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 Some of the leading players in the Vietnam LED Packaging market are Samsung, LG Innotek, Cree, Osram, Nichia, Epistar, Lumileds, Stanley Electric, Seoul Semiconductor, Kulicke & Soffa etc.

TechSci Research performed both primary as well as exhaustive secondary research for this study. Initially, TechSci Research sourced a list of manufacturers in Vietnam. Subsequently, TechSci Research conducted primary research surveys with the identified companies. While interviewing, the respondents were also enquired about their competitors. Through this technique, TechSci Research could include the manufacturers which could not be identified due to the limitations of secondary research. TechSci Research analysed the components, types, business functions, deployment models, distribution channels and presence of all major manufacturers in Vietnam.

TechSci Research calculated the market size of Vietnam LED Packaging using a bottom-up approach, where value sales data for LED Packaging market was recorded and forecast for the future years. TechSci Research sourced these values from the industry experts and company representatives and externally validated through analysing historical data of these product types and applications for getting an appropriate, overall market size. Various secondary sources such as company website, news articles, press releases, company annual reports, investor presentations and financial reports were also used by TechSci Research.

Key Target Audience:

  • LED Packaging Providers.
  • Raw Material Suppliers.
  • Distributors and Traders of LED materials.
  • Manufacturing Equipment Providers.
  • Research Organizations and Consulting Companies.
  • Market Research and Consulting firms.

The study is useful in providing answers to several critical questions that are important for the industry stakeholders such as manufacturers, partners, end users, etc., besides allowing them in strategizing investments and capitalizing on market opportunities.

Report Scope:

In this report, Vietnam LED Packaging market has been segmented into following categories, in addition to the industry trends which have also been detailed below:

  • Market, By Package Type:
    • Surface Mount Device Package (SMD)
    • Chip on Board Package (COB)
    • Chip Scale Package (CSP)
    • Others
  • Market, By Packaging Material:
    • Lead Frames
    • Substrates
      • Silicon Carbide
      • Silicon
      • Sapphire
    • Ceramic Packages
      • LEDs With Sintered Ceramic Package
      • LEDs With Ceramic Substrate and Silicon
      • LEDs With Ceramic Substrate and Glass
    • Bonding Wire
    • Encapsulation Resins
    • Other Packaging Materials
  • Market, By Applications:
    • General Lighting
      • Residential Lighting
      • Industrial Lighting
      • Outdoor Lighting
      • Other General Lighting
    • Automotive Lighting
      • Interior Lighting
      • Exterior Lighting
    • Backlighting
    • Other Applications
  • Market, by Region:
    • North Vietnam
    • South Vietnam
    • Central Vietnam

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in LED Packaging Market.

Available Customizations:

With the given market data, TechSci Research offers customizations according the company’s specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Profit Margin Analysis

  • Profit margin analysis in case of direct and indirect sales channel.
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In case you don’t find what you are looking for, please get in touch with our custom research team at sales@techsciresearch.com

1.    Product Overview

2.    Research Methodology

3.    Executive Summary

4.    Voice of Customers

4.1.  Vendor Satisfaction

4.2.  Vendor Challenges

4.3.  Overall Satisfaction Analysis

5.    Vietnam LED Packaging Market Landscape

6.    Vietnam LED Packaging Market Outlook

6.1.  Market Size & Forecast

6.1.1.     By Value

6.2.  Market Share & Forecast

6.2.1.     By Package Type (Chip Scale Package (CSP), Surface Mount Device Package (SMD), Chip on Board Package (COB) and Others)

6.2.2.     By Packaging Material (Lead Frames, Substrates, Ceramic Packages, Bonding Wire, Encapsulation Resins and Other Packaging Materials)

6.2.3.     By Applications (General Lighting, Automotive Lighting, Backlighting and Other Applications)

6.2.4.     By Company

6.2.5.     By Region

6.3.  Market Attractiveness Index

7.    Vietnam Market Outlook

7.1.  Market Size & Forecast

7.1.1.     By Value

7.2.  Market Share & Forecast

7.2.1.     By Packaging Material

7.2.2.     By Applications

8.    Vietnam Chip Scale Package Market Outlook

8.1.  Market Size & Forecast

8.1.1.     By Value

8.2.  Market Share & Forecast

8.2.1.     By Packaging Material

8.2.2.     By Applications

9.    Vietnam Chip on Board Package Market Outlook

9.1.  Market Size & Forecast

9.1.1.     By Value

9.2.  Market Share & Forecast

9.2.1.     By Packaging Material

9.2.2.     By Applications

10.  Market Dynamics

10.1.              Drivers

10.2.              Challenges

11.  Market Trends & Developments

12.  Supply Chain Analysis

13.  Policy & Regulatory

14.  Vietnam Economic Profile

15.  Competitive Landscape

16. Strategic Recommendations

In case you don’t find what you are looking for, please get in touch with our custom research team at sales@techsciresearch.com