Vapor Chamber Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type (Ultra Thin Vapor Chamber, Standard Vapor Chamber), By Application (Phone, Other Mobile Devices, Laptop, Gaming Consoles, Data Centers, LED Lights, Others), By Material (Copper, Aluminum, Others), By Cooling (Active, Passive), By Price Range (Economy, Mid-Range, Premium), By Distribution Channel (Online, Offline), By End-User (Individual Consumer, Business Enterprise), By Region, and By Competition, 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 1.34 Billion
CAGR (2026-2031)	20.02%
Fastest Growing Segment	Offline
Largest Market	Asia Pacific
Market Size (2031)	USD 4.01 Billion

Market Overview

The Global Vapor Chamber Market will grow from USD 1.34 Billion in 2025 to USD 4.01 Billion by 2031 at a 20.02% CAGR. A vapor chamber is a planar thermal management device that utilizes two-phase cooling to spread heat effectively across a sealed vacuum enclosure containing a working fluid. The market is primarily driven by the intensifying thermal loads in high-performance computing and the global expansion of 5G infrastructure, both of which demand superior heat dissipation capacities that exceed the performance of traditional solid metal heat spreaders or heat pipes.

Nevertheless, the volatility of raw material prices constitutes a significant barrier to consistent market expansion as it directly affects manufacturing scalability. According to IPC, in 2024, 45 percent of electronics manufacturers reported rising material costs. This financial instability creates a challenging environment for suppliers and hampers the widespread adoption of these advanced cooling modules within cost-sensitive consumer electronic sectors.

Key Market Drivers

The proliferation of AI-driven chipsets requiring efficient heat dissipation is a primary force propelling the Global Vapor Chamber Market. As high-performance computing (HPC) workloads intensify to support generative artificial intelligence, next-generation processors are reaching thermal design power (TDP) levels that traditional heat sinks cannot manage effectively. This thermal density necessitates the superior planar heat spreading capabilities of vapor chambers to ensure operational stability in hyperscale data centers. The urgency of this demand is reflected in the order books of major infrastructure suppliers who provide thermal management solutions. According to Vertiv, April 2024, in the 'First Quarter 2024 Results Announcement', order rates increased by 60 percent year-over-year largely due to accelerating demand for AI-related thermal management infrastructure. This surge underscores the critical transition from conventional cooling to advanced two-phase systems in server environments.

Simultaneously, the miniaturization of consumer electronics and smartphones, coupled with the rapid expansion of 5G network infrastructure, necessitates compact yet powerful thermal solutions. Mobile device manufacturers are increasingly integrating ultra-thin vapor chambers to dissipate the intense heat generated by 5G modems and high-speed processors without increasing the device's thickness. According to Samsung Electronics, January 2024, in the 'Galaxy S24 Press Release', the vapor chamber integrated into the S24 Ultra model is 1.9 times larger than its predecessor, a modification explicitly designed to improve surface temperature control during high-performance tasks. This hardware evolution is directly correlated with the broadening user base for high-speed connectivity; according to Ericsson, in 2024, global 5G subscriptions grew by 160 million in the first quarter alone, creating a sustained requirement for thermally efficient mobile hardware capable of handling faster data transmission rates.

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Key Market Challenges

The volatility of raw material prices acts as a substantial impediment to the growth of the Global Vapor Chamber Market. Vapor chambers are predominantly constructed from copper, a commodity subject to significant market fluctuations. When material costs become unpredictable, manufacturers face difficulties in maintaining stable production expenses, which complicates long-term contract negotiations with consumer electronics OEMs. This financial unpredictability forces suppliers to operate with thinner profit margins or increase unit prices, effectively rendering vapor chambers less commercially viable for mid-range or budget-friendly devices compared to cheaper cooling alternatives like traditional heat pipes.

According to IPC, in March 2025, 59 percent of electronics manufacturers reported experiencing rising material costs. This sharp increase in input expenses directly constrains the ability of vapor chamber producers to scale operations cost-effectively. Consequently, the high expense associated with material procurement slows the transition from standard thermal solutions to advanced vapor chambers in mass-market applications, limiting the technology's penetration primarily to premium, high-margin sectors such as flagship smartphones and enterprise-grade servers.

Key Market Trends

The development of three-dimensional (3D) vapor chambers is emerging as a critical evolution to address the thermal limitations of air-cooled high-performance computing (HPC) and AI server infrastructure. As thermal design power (TDP) levels for next-generation AI accelerators climb rapidly, traditional planar vapor chambers are insufficient for dissipating extreme heat flux within standard rack dimensions, necessitating a shift to 3D architectures that integrate vertical heat transport capabilities. This geometric innovation extends the viability of air cooling, delaying the capital-intensive transition to liquid cooling systems for hyperscale data centers. According to Auras Technology, May 2025, in the 'Computex 2025 Exhibition Highlights', the company successfully developed a new 3D Loop Vapor Chamber capable of dissipating 1,600 watts of thermal energy, a threshold previously achievable only through direct-to-chip liquid cooling solutions.

Simultaneously, the widespread adoption of ultra-thin vapor chambers in slim consumer electronics is being propelled by the requirement for sustained on-device generative AI processing. Major smartphone manufacturers, who previously relied on graphite sheets, are now integrating custom-engineered vapor chambers to manage the intensive neural engine workloads of 3nm chipsets without compromising device thinness or ergonomics. This strategic hardware shift is essential for preventing thermal throttling during continuous AI inference tasks, thereby ensuring consistent user experiences in flagship devices. According to Apple, September 2025, in the 'iPhone 17 Pro Product Announcement', the integration of a newly designed vapor chamber cooling system enabled the device to deliver approximately 40 percent better sustained performance under heavy computational loads compared to its predecessor.

Segmental Insights

Based on data from leading market research, the Offline segment is recognized as the fastest-growing distribution channel in the Global Vapor Chamber Market. This expansion is primarily driven by the dominance of business-to-business transactions, where Original Equipment Manufacturers prioritize direct engagement to procure thermal components in bulk. Unlike standard retail products, vapor chambers frequently require specific customization and rigorous technical verification to fit complex electronic assemblies. These requirements necessitate in-depth engineering consultations and physical product inspections, which are best facilitated through direct sales teams and authorized distributors, thereby accelerating the growth of the offline channel.

Regional Insights

Asia Pacific maintains a leading position in the Global Vapor Chamber Market due to its status as a primary manufacturing hub for consumer electronics. Countries such as China and Taiwan host extensive production facilities for smartphones and computing devices, which increasingly utilize vapor chambers for thermal management. The rising demand for gaming consoles and the expansion of telecommunications infrastructure across the region further support this dominance. Additionally, the localized supply chain for copper and manufacturing components allows regional companies to meet production requirements efficiently, driving sustained market stability within the sector.

Recent Developments

• In November 2024, Delta Electronics showcased a comprehensive range of thermal management solutions for AI and cloud computing data centers at the Electronica trade fair. The company presented its advanced 3D Vapor Chambers, which were paired with high-performance fans to provide air-cooling capabilities for graphics processing units with thermal design power requirements below 1,200 watts. This development addressed the critical need for efficient heat dissipation in high-density server environments driven by artificial intelligence workloads. The showcase illustrated the expansion of vapor chamber technology beyond consumer electronics into the enterprise and industrial cooling sectors.
• In May 2024, Realme released the GT 6T smartphone, which marketed an advanced "Iceberg Vapor Cooling System" as a key feature for performance-oriented users. The device was equipped with a dual vapor chamber setup boasting a total surface area of over 10,000 square millimeters, which the company claimed was one of the largest available in the industry at the time. This 9-layer cooling architecture was specifically designed to dissipate heat from the system-on-chip and other core components, aiming to prevent overheating during prolonged gaming sessions. The product launch underscored the trend of smartphone manufacturers significantly increasing the physical dimensions of vapor chambers to differentiate their devices.
• In January 2024, Samsung Electronics launched its Galaxy S24 smartphone series, which featured a significantly upgraded thermal management system to enhance device performance. The company integrated a larger vapor chamber across all models in the lineup to ensure sustained processing speeds during intensive tasks such as gaming and high-resolution video recording. Specifically, the premium Ultra model utilized a cooling system that was 1.9 times larger than its predecessor, while the other models in the series saw size increases of 1.6 times and 1.5 times respectively. This hardware improvement addressed thermal throttling concerns and highlighted the growing reliance on advanced vapor chamber technology in the competitive mobile device market.
• In January 2024, Cooler Master unveiled the V8 3DVC, a high-performance CPU air cooler, during the Consumer Electronics Show. This new product introduced a redesigned vapor chamber combined with superconductive composite heat pipes, a technology engineered to handle thermal loads of up to 300 watts. The cooling unit was designed to distribute heat more evenly and efficiently than traditional copper base models, targeting gamers and creative professionals who require stable temperatures for high-end processors. This launch demonstrated the continuing evolution of vapor chamber applications in desktop computing to manage the increasing heat output of modern central processing units.

Key Market Players

• Delta Electronics, Inc.
• Fujikura Ltd.
• Advanced Cooling Technologies, Inc.
• Celsia Inc.
• T-Global Technology (Europe & N. America) Ltd
• Chaun-Choung Technology Corp.
• Jentech Precision Industrial Co., LTD
• Jones Tech USA Inc.,
• Advanced Thermal Solutions, Inc.
• Murata Manufacturing Co., Ltd

By Type	By Application	By Material	By Cooling	By Price Range	By Distribution Channel	By End-User	By Region
Ultra Thin Vapor Chamber Standard Vapor Chamber	Phone Other Mobile Devices Laptop Gaming Consoles Data Centers LED Lights Others	Copper Aluminum Others	Active Passive	Economy Mid-Range Premium	Online Offline	Individual Consumer Business Enterprise	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Vapor Chamber Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Vapor Chamber Market, By Type:

• Ultra Thin Vapor Chamber
• Standard Vapor Chamber

• Vapor Chamber Market, By Application:

• Phone
• Other Mobile Devices
• Laptop
• Gaming Consoles
• Data Centers
• LED Lights
• Others

• Vapor Chamber Market, By Material:

• Copper
• Aluminum
• Others

• Vapor Chamber Market, By Cooling:

• Active
• Passive

• Vapor Chamber Market, By Price Range:

• Economy
• Mid-Range
• Premium

• Vapor Chamber Market, By Distribution Channel:

• Online
• Offline

• Vapor Chamber Market, By End-User:

• Individual Consumer
• Business Enterprise

• Vapor Chamber Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE