United States LED Packaging Market
is expected to grow at a robust CAGR, over the next five years, because of the increasing
adoption of LED packaging in end use industries like electronics where LEDs are
used in display panels of televisions and mobile phones. Moreover, the growing
use of high grade and efficient LED Packages for various lighting applications
and the rising demand for smart, energy conserving lighting solutions for
residential as well as industrial lighting will drive the United States LED
Packaging Market further. Based on package type segment of the LED Packaging market, Chip
Scale Package (CSP) is predicted to lead the market in the next five years, due
to its advantages like thinner profile, compact package footprint, reduced
weight and better electrical performance etc over others. Based on the
applications, general lightning segment is anticipated to occupy the largest
market share in the forecast period due to the increasing need of
cost-effective and energy saving lighting in residential and commercial areas.
Years considered
for this report:
Historical Years: 2016-2019
Base Year: 2020
Estimated Year: 2021
Forecast Period: 2022–2026
Objective of the Study:
- To analyse and forecast the
market size of the United States LED Packaging Market, in terms of value.
- To classify and forecast the
United States LED Packaging Market based on package type, packaging
material, applications and regional distribution.
- To identify drivers and
challenges for the United States LED Packaging Market.
- To examine competitive
developments such as expansions, mergers & acquisitions, etc., in the United
States LED Packaging Market.
- To conduct the pricing
analysis for the United States LED Packaging Market.
- To identify and analyse the
profile of leading players involved in the manufacturing of the United
States LED Packaging Market.
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Some of the leading players in the
United States LED Packaging market are Samsung, LG Innotek, Cree, Osram, Nichia, Epistar, Lumileds,
Stanley Electric, Seoul Semiconductor, Kulicke & Soffa etc.
TechSci Research performed both primary
as well as exhaustive secondary research for this study. Initially, TechSci
Research sourced a list of manufacturers in the United States. Subsequently,
TechSci Research conducted primary research surveys with the identified
companies. While interviewing, the respondents were also enquired about their
competitors. Through this technique, TechSci Research could include the
manufacturers which could not be identified due to the limitations of secondary
research. TechSci Research analysed the components, types, business functions,
deployment models, distribution channels and presence of all major
manufacturers in the United States.
TechSci Research calculated the market size of United States LED
Packaging using a bottom-up approach, where value sales data for LED Packaging market
was recorded and forecast for the future years. TechSci Research sourced these
values from the industry experts and company representatives and externally
validated through analysing historical data of these product types and
applications for getting an appropriate, overall market size. Various secondary
sources such as company website, news articles, press releases, company annual
reports, investor presentations and financial reports were also used by TechSci
Research.
Key Target Audience:
- LED
Packaging Providers.
- Raw
Material Suppliers.
- Distributors
and Traders of LED materials.
- Manufacturing
Equipment Providers.
- Research
Organizations and Consulting Companies.
- Market
Research and Consulting firms.
The study is useful in providing answers
to several critical questions that are important for the industry stakeholders
such as manufacturers, partners, end users, etc., besides allowing them in
strategizing investments and capitalizing on market opportunities.
Report Scope:
In this report, United States LED
Packaging market has been segmented into following categories, in addition to
the industry trends which have also been detailed below:
- United States
LED Packaging Market, By Package Type:
- Surface Mount Device Package (SMD)
- Chip on Board Package (COB)
- Chip Scale Package (CSP)
- Others
- United States
LED Packaging Market, By Packaging Material:
- Lead Frames
- Substrates
- Silicon Carbide
- Silicon
- Sapphire
- Ceramic Packages
- LEDs With Sintered Ceramic Package
- LEDs With Ceramic Substrate and Silicon
- LEDs With Ceramic Substrate and Glass
- Bonding Wire
- Encapsulation Resins
- Other Packaging Materials
- United States
LED Packaging Market, By Applications:
- General Lighting
- Residential Lighting
- Industrial Lighting
- Outdoor Lighting
- Other General Lighting
- Automotive Lighting
- Interior Lighting
- Exterior Lighting
- Backlighting
- Other Applications
- United States
LED Packaging Market, by Region:
- Northeast Region
- South Region
- Mid-West Region
- West Region
Competitive
Landscape
Company Profiles: Detailed analysis of the major
companies present in LED Packaging Market.
Available
Customizations:
With the given market data, TechSci
Research offers customizations according the company’s specific needs. The
following customization options are available for the report:
Company Information
- Detailed
analysis and profiling of additional market players (up to five).
Profit Margin Analysis
- Profit
margin analysis in case of direct and indirect sales channel.
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