United States LED Packaging Market
is expected to grow at a robust CAGR, over the next five years, because of the increasing
adoption of LED packaging in end use industries like electronics where LEDs are
used in display panels of televisions and mobile phones. Moreover, the growing
use of high grade and efficient LED Packages for various lighting applications
and the rising demand for smart, energy conserving lighting solutions for
residential as well as industrial lighting will drive the United States LED
Packaging Market further. Based on package type segment of the LED Packaging market, Chip
Scale Package (CSP) is predicted to lead the market in the next five years, due
to its advantages like thinner profile, compact package footprint, reduced weight
and better electrical performance etc over others. Based on the applications,
general lightning segment is anticipated to occupy the largest market share in
the forecast period due to the increasing need of cost-effective and energy
saving lighting in residential and commercial areas.
Years
considered for this report:
Historical Years: 2015-2018
Base Year: 2019
Estimated Year: 2020
Forecast Period: 2021–2025
Objective
of the Study:
- To analyse and forecast the market size of the United States LED
Packaging Market, in terms of value.
- To classify and forecast the United States LED Packaging Market based
on package type, packaging material, applications and regional
distribution.
- To identify drivers and challenges for the United States LED
Packaging Market.
- To examine competitive developments such as expansions, mergers
& acquisitions, etc., in the United States LED Packaging Market.
- To conduct the pricing analysis for the United States LED Packaging
Market.
- To identify and analyse the profile of leading players involved in
the manufacturing of the United States LED Packaging Market.

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Some of the leading players in the
United States LED Packaging market are Samsung, LG Innotek, Cree, Osram, Nichia, Epistar, Lumileds,
Stanley Electric, Seoul Semiconductor, Kulicke & Soffa etc.
TechSci Research performed both primary
as well as exhaustive secondary research for this study. Initially, TechSci
Research sourced a list of manufacturers in the United States. Subsequently,
TechSci Research conducted primary research surveys with the identified
companies. While interviewing, the respondents were also enquired about their
competitors. Through this technique, TechSci Research could include the
manufacturers which could not be identified due to the limitations of secondary
research. TechSci Research analysed the components, types, business functions,
deployment models, distribution channels and presence of all major
manufacturers in the United States.
TechSci Research calculated the market size of United States LED
Packaging using a bottom-up approach, where value sales data for LED Packaging market
was recorded and forecast for the future years. TechSci Research sourced these
values from the industry experts and company representatives and externally
validated through analysing historical data of these product types and
applications for getting an appropriate, overall market size. Various secondary
sources such as company website, news articles, press releases, company annual
reports, investor presentations and financial reports were also used by TechSci
Research.

Key Target Audience:
- LED
Packaging Providers.
- Raw
Material Suppliers.
- Distributors
and Traders of LED materials.
- Manufacturing
Equipment Providers.
- Research
Organizations and Consulting Companies.
- Market
Research and Consulting firms.
The study is useful in providing answers
to several critical questions that are important for the industry stakeholders
such as manufacturers, partners, end users, etc., besides allowing them in
strategizing investments and capitalizing on market opportunities.
Report Scope:
In this report, United States LED
Packaging market has been segmented into following categories, in addition to
the industry trends which have also been detailed below:
- Market, By Package Type:
- Surface Mount Device Package (SMD)
- Chip on Board Package (COB)
- Chip Scale Package (CSP)
- Others
- Market, By Packaging
Material:
- Lead Frames
- Substrates
- Silicon Carbide
- Silicon
- Sapphire
- Ceramic Packages
- LEDs With Sintered Ceramic Package
- LEDs With Ceramic Substrate and Silicon
- LEDs With Ceramic Substrate and Glass
- Bonding Wire
- Encapsulation Resins
- Other Packaging Materials
- Market, By Applications:
- General Lighting
- Residential Lighting
- Industrial Lighting
- Outdoor Lighting
- Other General Lighting
- Automotive Lighting
- Interior Lighting
- Exterior Lighting
- Backlighting
- Other Applications
- Market, by
Region:
- Northeast Region
- South Region
- Mid-West Region
- West Region
Competitive
Landscape
Company Profiles: Detailed analysis of the major
companies present in LED Packaging Market.
Available
Customizations:
With the given market data, TechSci
Research offers customizations according the company’s specific needs. The
following customization options are available for the report:
Company Information
- Detailed
analysis and profiling of additional market players (up to five).
Profit Margin Analysis
- Profit
margin analysis in case of direct and indirect sales channel.
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be released soon. If you wish an early delivery of this report or want to
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