United States LED Packaging Market is expected to grow at a robust CAGR, over the next five years, because of the increasing adoption of LED packaging in end use industries like electronics where LEDs are used in display panels of televisions and mobile phones. Moreover, the growing use of high grade and efficient LED Packages for various lighting applications and the rising demand for smart, energy conserving lighting solutions for residential as well as industrial lighting will drive the United States LED Packaging Market further. Based on package type segment of the LED Packaging market, Chip Scale Package (CSP) is predicted to lead the market in the next five years, due to its advantages like thinner profile, compact package footprint, reduced weight and better electrical performance etc over others. Based on the applications, general lightning segment is anticipated to occupy the largest market share in the forecast period due to the increasing need of cost-effective and energy saving lighting in residential and commercial areas.

Years considered for this report:

Historical Years: 2016-2019

Base Year: 2020

Estimated Year: 2021

Forecast Period: 2022–2026

Objective of the Study:

  • To analyse and forecast the market size of the United States LED Packaging Market, in terms of value.
  • To classify and forecast the United States LED Packaging Market based on package type, packaging material, applications and regional distribution.
  • To identify drivers and challenges for the United States LED Packaging Market.
  • To examine competitive developments such as expansions, mergers & acquisitions, etc., in the United States LED Packaging Market.
  • To conduct the pricing analysis for the United States LED Packaging Market.
  • To identify and analyse the profile of leading players involved in the manufacturing of the United States LED Packaging Market.

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Some of the leading players in the United States LED Packaging market are Samsung, LG Innotek, Cree, Osram, Nichia, Epistar, Lumileds, Stanley Electric, Seoul Semiconductor, Kulicke & Soffa etc.

TechSci Research performed both primary as well as exhaustive secondary research for this study. Initially, TechSci Research sourced a list of manufacturers in the United States. Subsequently, TechSci Research conducted primary research surveys with the identified companies. While interviewing, the respondents were also enquired about their competitors. Through this technique, TechSci Research could include the manufacturers which could not be identified due to the limitations of secondary research. TechSci Research analysed the components, types, business functions, deployment models, distribution channels and presence of all major manufacturers in the United States.

TechSci Research calculated the market size of United States LED Packaging using a bottom-up approach, where value sales data for LED Packaging market was recorded and forecast for the future years. TechSci Research sourced these values from the industry experts and company representatives and externally validated through analysing historical data of these product types and applications for getting an appropriate, overall market size. Various secondary sources such as company website, news articles, press releases, company annual reports, investor presentations and financial reports were also used by TechSci Research.

Key Target Audience:

  • LED Packaging Providers.
  • Raw Material Suppliers.
  • Distributors and Traders of LED materials.
  • Manufacturing Equipment Providers.
  • Research Organizations and Consulting Companies.
  • Market Research and Consulting firms.

The study is useful in providing answers to several critical questions that are important for the industry stakeholders such as manufacturers, partners, end users, etc., besides allowing them in strategizing investments and capitalizing on market opportunities.

Report Scope:

In this report, United States LED Packaging market has been segmented into following categories, in addition to the industry trends which have also been detailed below:

  • United States LED Packaging Market, By Package Type:
    • Surface Mount Device Package (SMD)
    • Chip on Board Package (COB)
    • Chip Scale Package (CSP)
    • Others
  • United States LED Packaging Market, By Packaging Material:
    • Lead Frames
    • Substrates
      • Silicon Carbide
      • Silicon
      • Sapphire
    • Ceramic Packages
      • LEDs With Sintered Ceramic Package
      • LEDs With Ceramic Substrate and Silicon
      • LEDs With Ceramic Substrate and Glass
    • Bonding Wire
    • Encapsulation Resins
    • Other Packaging Materials
  • United States LED Packaging Market, By Applications:
    • General Lighting
      • Residential Lighting
      • Industrial Lighting
      • Outdoor Lighting
      • Other General Lighting
    • Automotive Lighting
      • Interior Lighting
      • Exterior Lighting
    • Backlighting
    • Other Applications
  • United States LED Packaging Market, by Region:
    • Northeast Region
    • South Region
    • Mid-West Region
    • West Region

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in LED Packaging Market.

Available Customizations:

With the given market data, TechSci Research offers customizations according the company’s specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Profit Margin Analysis

  • Profit margin analysis in case of direct and indirect sales channel.
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1.     Product Overview

2.     Research Methodology

3.     Impact of COVID-19 on United States LED Packaging Market

4.     Executive Summary

5.     Voice of Customers

5.1.   Vendor Satisfaction

5.2.   Vendor Challenges

5.3.   Overall Satisfaction Analysis

6.     United States LED Packaging Market Landscape

7.     United States LED Packaging Market Outlook

7.1.   Market Size & Forecast

7.1.1.      By Value

7.2.   Market Share & Forecast

7.2.1.      By Package Type (Chip Scale Package (CSP), Surface Mount Device Package (SMD), Chip on Board Package (COB) and Others)

7.2.2.      By Packaging Material (Lead Frames, Substrates, Ceramic Packages, Bonding Wire, Encapsulation Resins and Other Packaging Materials)

7.2.3.      By Applications (General Lighting, Automotive Lighting, Backlighting and Other Applications)

7.2.4.      By Company

7.2.5.      By Region

7.3.   Market Attractiveness Index

8.     United States Chip Scale Package Market Outlook

8.1.   Market Size & Forecast

8.1.1.      By Value

8.2.   Market Share & Forecast

8.2.1.      By Packaging Material

8.2.2.      By Applications

9.     United States Surface Mount Device Package Market Outlook

9.1.   Market Size & Forecast

9.1.1.      By Value

9.2.   Market Share & Forecast

9.2.1.      By Packaging Material

9.2.2.      By Applications

10.  United States Chip on Board Package Market Outlook

10.1.                 Market Size & Forecast

10.1.1.   By Value

10.2.                 Market Share & Forecast

10.2.1.   By Packaging Material

10.2.2.   By Applications

11.  Market Dynamics

11.1.                 Drivers

11.2.                 Challenges

12.  Market Trends & Developments

13.  Supply Chain Analysis

14.  Policy & Regulatory

15.  United States Economic Profile

16.  Competitive Landscape

17.  Strategic Recommendations