Through Hole Passive Components Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Component (Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, and Others), By Leads Model (Axial Leads and Radial Leads), By Application (Consumer Electronics, IT & Telecommunication, Automotive, Industrial, Aerospace & Defense, Healthcare, and Others) By Region, and By Competition 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 37.29 Billion
CAGR (2026-2031)	8.88%
Fastest Growing Segment	Sensors
Largest Market	Asia Pacific
Market Size (2031)	USD 62.13 Billion

Market Overview

The Global Through Hole Passive Components Market will grow from USD 37.29 Billion in 2025 to USD 62.13 Billion by 2031 at a 8.88% CAGR. Through-hole passive components are electronic elements such as resistors, capacitors, and inductors that feature leads designed to be inserted through drilled holes in a printed circuit board and soldered to establish a connection. The primary drivers supporting the sustained demand for these components include their superior mechanical bond strength and ability to withstand high thermal and mechanical stress, making them indispensable for mission-critical applications in the aerospace, automotive, and heavy industrial sectors. Furthermore, they remain the preferred choice for high-power and high-voltage circuits where reliability and ease of manual prototyping or repair are essential requirements. According to the Japan Electronics and Information Technology Industries Association, in 2024, global production for the electronics and IT industries was forecast to grow by 9 percent, indicating a robust industrial environment that continues to generate baseline demand for essential electronic constituents.

A significant challenge impeding the broader expansion of this market is the pervasive industry shift toward Surface Mount Technology which offers higher component density and compatibility with automated assembly processes. This technological preference for miniaturization restricts the adoption of through-hole architectures in compact consumer electronics and high-volume manufacturing environments where space optimization is critical. Consequently, manufacturers frequently prioritize surface mount alternatives to achieve greater production efficiency and reduced device footprints, thereby limiting the growth potential of legacy through-hole components in rapidly evolving application segments.

Key Market Drivers

The rising demand for high-reliability automotive electronics and EV powertrains acts as a primary catalyst for the adoption of through-hole passive components. As manufacturers transition toward electrification, the requirement for components enduring thermal cycling and high-voltage loads becomes critical. Through-hole resistors and capacitors are integrated into inverters because their leaded architecture provides robust mechanical anchorage against vibrations. According to the International Energy Agency, April 2024, in the 'Global EV Outlook 2024', nearly 14 million new electric cars were registered globally in 2023, underscoring the production scale requiring these durable elements. This surge ensures a dependency on through-hole technology for power applications where surface mount alternatives lack necessary thermal resilience.

Simultaneously, the growth of renewable energy systems requiring high-power component handling reinforces the utility of through-hole designs. Solar inverters and wind turbine controls operate at high voltages demanding components with superior thermal management. Through-hole devices allow for greater heat dissipation compared to surface mount counterparts. According to the International Renewable Energy Agency, March 2024, in the 'Renewable Capacity Statistics 2024', global renewable generation capacity increased by 473 gigawatts in 2023, reflecting a massive deployment of hardware using robust sub-assemblies. The broader market supports this trajectory; according to the World Semiconductor Trade Statistics, in 2024, the global semiconductor market was projected to increase by 16 percent, creating parallel demand for passive components.

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Key Market Challenges

The rapid industry-wide transition toward Surface Mount Technology represents the primary impediment to the expansion of the Global Through Hole Passive Components Market. This shift is fundamentally driven by the relentless demand for miniaturization and the necessity to optimize component density on printed circuit boards. Surface mount counterparts offer superior compatibility with high-speed automated assembly systems, significantly reducing manufacturing costs compared to the manual or semi-automated insertion processes required for through-hole leads. Consequently, producers of high-volume consumer electronics are systematically phasing out through-hole architectures in favor of formats that support lighter and more efficient device designs.

This technological displacement creates a substantial barrier to growth for legacy products outside of niche industrial sectors. The dampening effect of this trend is evident in recent trade statistics which reflect the struggle of traditional categories. According to the Japan Electronics and Information Technology Industries Association, in June 2024, the import value of passive components decreased to approximately 14.5 billion yen, representing roughly 87 percent of the value recorded during the same period in the previous year. This contraction highlights the declining commercial reliance on traditional passive component categories in a market that increasingly favors surface mount technologies.

Key Market Trends

The advancement of automated robotic insertion and AI-driven manufacturing is fundamentally reshaping the production landscape for through-hole passive components. Manufacturers are increasingly deploying advanced insertion machines that eliminate the traditional reliance on manual labor, thereby neutralizing the cost disparities between through-hole and surface mount assembly. This transition is critical for maintaining the viability of leaded resistors and capacitors in mass-production environments where precision and speed are paramount. According to the IPC, May 2024, in the 'Current Sentiment of the Global Electronics Manufacturing Supply Chain Report', 59 percent of electronics manufacturers reported experiencing a rise in labor costs, a statistic that underscores the urgent industrial imperative to adopt automated solutions for legacy component integration.

Simultaneously, there is a notable expansion in high-fidelity audio and niche analog signal applications where through-hole architectures remain the standard for superior signal integrity. Audiophile-grade equipment and professional sound systems continue to utilize leaded film capacitors and metal film resistors due to their preferable thermal mass and noise characteristics compared to miniaturized surface mount alternatives. This enduring preference is sustaining a specialized market segment focused on performance rather than density. According to the Yamaha Corporation, May 2024, in the 'Annual Report 2024', revenue in the audio equipment segment increased by 12.5 percent year-on-year, highlighting the robust commercial momentum in sectors that prioritize the distinct acoustic properties offered by traditional passive component formats.

Segmental Insights

The Sensors segment is currently identified as the fastest-growing category within the Global Through Hole Passive Components Market. This rapid expansion is primarily driven by the accelerating adoption of industrial automation and advanced automotive technologies, including electric vehicles. Through-hole mounting remains the preferred choice for these critical sensing applications due to its superior mechanical stability and resistance to high thermal and vibrational stress compared to surface-mount alternatives. As the global shift toward Industry 4.0 necessitates precise data monitoring in harsh operational environments, the demand for these durable, high-reliability sensors continues to rise significantly.

Regional Insights

Asia Pacific dominates the Global Through Hole Passive Components Market, primarily due to its position as the global epicenter for electronics manufacturing. The region benefits from a dense concentration of production facilities in China, Japan, South Korea, and Taiwan, which creates substantial demand for reliable components in the automotive and industrial sectors. This leadership is sustained by the local presence of key manufacturers and established supply chains that ensure cost-effective production. Furthermore, supportive frameworks from institutions like China’s Ministry of Industry and Information Technology actively encourage the expansion of domestic electronic component capabilities, reinforcing the region's industrial advantage.

Recent Developments

• In June 2025, Yageo Group launched the ALV70 series, distinguishing the product as the industry's first aluminum electrolytic capacitors to achieve a 750 V voltage rating. Designed for demanding high-performance applications such as renewable energy systems, industrial power supplies, and electric vehicle powertrains, these capacitors directly address the market need for high voltage resilience and efficient ripple current management. The series combines high capacitance density with a compact design and robust thermal endurance, operating effectively at temperatures up to 85°C. This technological breakthrough supports the development of next-generation power electronics that require stable and safe high-voltage energy storage.
• In January 2025, Stackpole Electronics released the HVA series of axial-leaded high-voltage resistors, explicitly designed to address the limited availability of such specialized components in the global market. The new series offers a broad resistance range from 1 MΩ to 1 GΩ and features a voltage coefficient of resistance of less than 20 ppm/V. These metal film resistors are specifically engineered for high-voltage sensing, medical equipment, and precision instrumentation applications. The product launch provides engineers with a cost-effective and reliable solution for circuits that require robust high voltage handling capabilities within a compact axial-leaded package structure.
• In October 2024, Panasonic Industry reaffirmed its strategic commitment to the development and supply of through-hole technology (THT) aluminum electrolytic capacitors. While some competitors have issued end-of-life notices for similar components, the company announced it would continue to offer its full portfolio of package sizes and capacitance values to meet ongoing market demand. The announcement highlighted the specific capabilities of the FR and FS series, which provide high performance, low equivalent series resistance (ESR), and extended lifespans of up to 10,000 hours. These components are essential for power supplies and industrial electronics where THT remains the preferred solution for reliability.
• In May 2024, Vishay Intertechnology introduced a new lead bending option for its AC and AC-AT series of cemented, axial-leaded wirewound resistors. The new WSZ lead form enables these traditionally through-hole components to be compatible with surface-mount pick-and-place machinery, thereby streamlining the assembly process for manufacturers. This innovation allows engineers to utilize the robust pulse capability and reliability of wirewound resistors while benefiting from the efficiency of automated surface-mount assembly lines. The resistors are AEC-Q200 qualified and designed for critical automotive and industrial applications, including pre-charging, discharge, and snubber circuits where high pulse load capability is essential.

Key Market Players

• Murata Manufacturing Co., Ltd.
• TDK Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• AVX Corporation
• KEMET Corporation
• Taiyo Yuden Co., Ltd.
• Würth Elektronik GmbH & Co. KG
• Yageo Corporation
• Samsung Electro-Mechanics Co., Ltd.

By Component	By Leads Model	By Application	By Region
Resistors Capacitors Inductors Diodes Transducers Sensors and Others	Axial Leads and Radial Leads	Consumer Electronics IT & Telecommunication Automotive Industrial Aerospace & Defense Healthcare and Others	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Through Hole Passive Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Through Hole Passive Components Market, By Component:

• Resistors
• Capacitors
• Inductors
• Diodes
• Transducers
• Sensors
• and Others

• Through Hole Passive Components Market, By Leads Model:

• Axial Leads and Radial Leads

• Through Hole Passive Components Market, By Application:

• Consumer Electronics
• IT & Telecommunication
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare
• and Others

• Through Hole Passive Components Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE