Semiconductor Memory IP Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Product (Volatile Memory, Non - Volatile Memory, Other), By End User (Consumer Electronics, Industrial, Automotive, Networking, Other), By Region and Competition, 2020-2030F

Market Overview

The Global Semiconductor Memory IP Market, valued at USD 8.17 Billion in 2024, is projected to experience a CAGR of 13.28% to reach USD 17.26 Billion by 2030. Semiconductor Memory IP refers to pre-designed and verified memory blocks integrated into larger semiconductor chips to facilitate data storage, caching, and buffering functions. Key drivers supporting this market's growth include the accelerating adoption of artificial intelligence and machine learning applications demanding specialized memory architectures, the proliferation of connected devices within the Internet of Things ecosystem, and the continuous miniaturization of electronic devices necessitating advanced memory solutions. According to the Semiconductor Industry Association, in 2023, sales of memory products, a critical segment enabled by memory IP, totaled $92.3 billion.

However, a significant challenge impeding market expansion is the persistent vulnerability of global supply chains and the emergence of geopolitical trade tensions, which can restrict access to crucial technologies and manufacturing capabilities. This introduces uncertainties in development and deployment, potentially limiting overall market growth.

Key Market Drivers

Two pivotal drivers significantly influencing the Global Semiconductor Memory IP Market are the accelerating adoption of artificial intelligence and machine learning applications, alongside the exponential growth of data and expansion of cloud and edge computing infrastructures. Artificial intelligence and machine learning workloads, particularly large language models, necessitate specialized memory architectures offering extreme bandwidth and low latency to efficiently process vast datasets. This demand directly fuels innovation and production in high-bandwidth memory solutions. For instance, according to The Korea Economic Daily, in March 2024, "Samsung set to triple HBM output in 2024 to lead AI chip era", Samsung Electronics Co. anticipated increasing its high bandwidth memory chip production volume by 2.9 times in 2024 compared to its 2023 output. This substantial increase highlights the critical role of memory IP in enabling advanced AI systems.

The second significant factor is the exponential data growth coupled with the continuous expansion of cloud and edge computing. Modern data centers and edge devices are processing increasingly complex workloads, demanding not only higher memory capacity but also enhanced speed and efficiency from memory IP. This intensifies the need for advanced memory solutions to manage real-time data processing and storage requirements across distributed environments. For example, according to Spheron's Blog, in September 2024, "How Much GPU Memory is Required to Run a Large Language Model? ", a 175-billion-parameter large language model requires 350GB of GPU memory for inference. This illustrates the immense memory demands driven by sophisticated data processing in these environments. The overall semiconductor market performance underscores these trends, with the Semiconductor Industry Association reporting in February 2025 that global semiconductor sales reached $627.6 billion in 2024, with memory products alone totaling $165.1 billion.

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Key Market Challenges

The persistent vulnerability of global supply chains and the emergence of geopolitical trade tensions present a significant challenge to the Global Semiconductor Memory IP Market. These factors introduce considerable uncertainties in the development and deployment of advanced memory solutions. Restricted access to crucial technologies and manufacturing capabilities directly impedes innovation and production cycles for memory IP blocks, which are essential components for modern electronic devices.

Such disruptions elevate operational costs and extend lead times for critical materials and specialized manufacturing processes. This environment creates uneven market performance across different geographies. For instance, according to the Semiconductor Industry Association, in 2024, annual semiconductor sales in Europe decreased by 8.1% compared to the previous year, highlighting how regional markets can be directly impacted by these broader global instabilities and trade policies. This directly limits the growth trajectory of the memory IP market by affecting demand and supply in key economic regions.

Key Market Trends

The Global Semiconductor Memory IP Market is significantly influenced by the increased adoption of emerging non-volatile memory technologies. This trend addresses the demand for memory solutions offering persistence, high endurance, and fast access, bridging the performance gap between volatile DRAM and traditional NAND flash. Emerging non-volatile memory (NVM) types, such as MRAM, ReRAM, and PCM, are increasingly integrated into specialized applications including in-memory computing, edge AI, and secure boot, where data retention during power loss and faster-than-storage access are crucial. This drives the development of tailored memory IP blocks that harness these unique NVM characteristics. According to the Japan Electronics and Information Technology Industries Association, in May 2023, the total electronic device production in Japan reached $6,722 million, illustrating an underlying demand for advanced electronic components. Companies are actively investing in these technologies; for instance, according to MRAM-Info, in June 2024, Samsung announced it finalized the development of its 14 nm embedded MRAM process and anticipated mass production by the end of 2024, achieving a 33% area scaling compared to its 28 nm process.

Another pivotal trend shaping the market is Memory IP Development for Chiplet-Based Designs. This approach involves integrating multiple specialized silicon dies, known as chiplets, onto a single package, offering enhanced modularity, scalability, and improved manufacturing yields compared to monolithic designs. For memory IP, this trend necessitates new development in inter-chiplet communication protocols, standardized memory interfaces, and efficient integration schemes for memory chiplets with logic counterparts. This fosters innovation in IP that supports high-speed, low-power interconnects, optimizing overall system performance and cost. According to the Semiconductor Industry Association, in February 2024, the overall semiconductor market was projected to grow by 11.5% in 2024, with chiplet designs contributing to this expansion by enabling more complex and powerful processors. A notable instance of this advancement occurred when, according to Electronic Design, in April 2024, Intel and Synopsys demonstrated the world's first multi-die system featuring chiplets connected by the Universal Chiplet Interconnect Express (UCIe), showcasing a collaborative effort to advance chiplet integration.

Segmental Insights

In the Global Semiconductor Memory IP Market, Non-Volatile Memory is emerging as the fastest-growing segment, driven by the escalating demand for advanced data storage solutions across various applications. This rapid expansion is primarily attributed to the crucial need for reliable, high-density memory in consumer electronics, automotive systems, and the expanding Internet of Things (IoT) ecosystem. Non-Volatile Memory IP cores offer significant advantages, including robust data retention, faster read/write speeds, and reduced power consumption, making them ideal for modern devices requiring persistent and efficient storage. Furthermore, continuous advancements in underlying semiconductor technologies and the proliferation of data-intensive applications like artificial intelligence further amplify the segment's growth trajectory.

Regional Insights

Asia Pacific dominates the Global Semiconductor Memory IP Market, driven by its robust manufacturing ecosystem and substantial investments in research and development across key economies. The region is home to major semiconductor manufacturers and suppliers, particularly in South Korea and Taiwan, which are renowned for advanced fabrication capabilities and memory chip production. This leadership is further bolstered by a vast consumer electronics market and widespread industrialization, fueling demand for memory solutions in automotive, artificial intelligence, Internet of Things, and 5G applications. Additionally, supportive governmental policies and well-established supply chains foster a conducive environment for sustained market leadership.

Recent Developments

• In October 2025, Weebit Nano announced a strategic partnership with onsemi, a global leader in power and automotive semiconductors. This collaboration focused on commercializing Resistive Random-Access Memory (ReRAM) technology, targeting advanced applications in AI and the automotive sector. The partnership highlighted ReRAM's potential as a disruptive alternative to traditional flash storage, addressing the growing demand for low-power and high-endurance memory solutions. Weebit Nano's IP was a key element in this endeavor, with test chips demonstrating the technology's reliability under extreme conditions and supporting its broader adoption in next-generation computing.

• In April 2025, Cadence Design Systems unveiled its HBM4 12.8Gbps memory IP solution, representing a significant advancement in memory technology. This solution was designed to meet the increasing memory bandwidth demands of System-on-Chips (SoCs) specifically targeting next-generation AI training and High-Performance Computing (HPC) hardware systems. The Cadence HBM4 solution was compatible with the JEDEC specification JESD270-4 and boasted an industry-leading performance of 12.8Gbps. This development was crucial for scaling AI infrastructure by promoting enhanced memory bandwidth and volume capabilities.

• In November 2024, TetraMem Inc. and SK hynix Inc. announced a significant research partnership to advance in-memory computing (IMC) for Artificial Intelligence applications. This collaboration involved signing a Statement of Work outlining their joint research project. The companies aimed to combine their complementary technologies, leveraging TetraMem's analog IMC platform and SK hynix's expertise in memory and AI memory technologies. This initiative was expected to drive breakthroughs in the scalability and market accessibility of new memory computing architectures, contributing to improvements in AI compute speed, capability, and power efficiency within the global semiconductor memory IP market.

• In September 2024, Rambus Inc. announced the introduction of its HBM4 Memory Controller IP, positioning it as an industry-first solution. This new offering aimed to significantly accelerate next-generation AI workloads by providing more than double the throughput of HBM3 at low latency. The HBM4 Controller IP solution was designed to enable designers to address the escalating memory bandwidth requirements of advanced AI accelerators and graphics processing units. This development expanded Rambus' silicon IP portfolio of high-performance memory solutions, reinforcing its position within the global semiconductor memory IP market.

Key Market Players

• Synopsys, Inc.
• Cadence Design Systems, Inc.
• ARM Limited
• Siemens AG
• Marvell Technology Inc.
• eMemory Technology Inc.
• SiFive, Inc.
• Mentor Graphics Corporation

Report Scope:

In this report, the Global Semiconductor Memory IP Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Semiconductor Memory IP Market, By Product:

o   Volatile Memory

o   Non - Volatile Memory

o   Other

• Semiconductor Memory IP Market, By End User:

o   Consumer Electronics

o   Industrial

o   Automotive

o   Networking

o   Other

• Semiconductor Memory IP Market, By Region:

o   North America

§  United States

§  Canada

§  Mexico

o   Europe

§  France

§  United Kingdom

§  Italy

§  Germany

§  Spain

o   Asia Pacific

§  China

§  India

§  Japan

§  Australia

§  South Korea

o   South America

§  Brazil

§  Argentina

§  Colombia

o   Middle East & Africa

§  South Africa

§  Saudi Arabia

§  UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Semiconductor Memory IP Market.

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Company Information

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