Power Supply In Package Chip Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Product (PSiP and PwrSoC), By Application (Telecom and IT, Automotive, Consumer Electronics, Medical Devices, and Military & Defense), By Region, By Competition, 2020-2030F

Market Overview

The Global Power Supply In Package Chip Market, valued at USD 3.06 Billion in 2024, is projected to experience a CAGR of 7.86% to reach USD 4.82 Billion by 2030. The Power Supply In Package (PSiP) chip integrates power management functions, such as DC-DC converters and voltage regulators, with other semiconductor components into a single compact package. This design optimizes power delivery, improves efficiency, and reduces the electronic system's footprint. Main market drivers include the pervasive trend of miniaturization in consumer electronics, the escalating demand for enhanced power efficiency, and the increasing complexity of devices requiring advanced power solutions.

A primary challenge impeding market expansion is the complexity of thermal management inherent in PSiP designs. Dense integration creates high power densities, demanding robust heat dissipation to ensure stable performance and device longevity. High initial development costs also present a notable barrier. According to the Semiconductor Industry Association, global semiconductor sales reached USD 574 billion in 2023, with power management integrated circuits, encompassing PSiP solutions, representing approximately 8% of this market value.

Key Market Drivers

The global Power Supply In Package chip market is significantly influenced by the continuous drive towards miniaturization and integration within electronic devices, alongside an escalating demand for energy-efficient power solutions. These twin imperatives directly impact the design and adoption of PSiP technologies, which are critical for optimizing power delivery and reducing system footprints across various applications. The broader semiconductor industry, which encompasses these power management solutions, demonstrated substantial growth, with Infineon Technologies AG reporting in November 2023 that its total revenue for fiscal year 2023 reached €16.309 billion, marking a 15 percent increase over the prior year.

The pervasive trend of miniaturization and integration in electronic devices necessitates compact power management solutions such as PSiP. As devices like smartphones, wearables, and advanced computing systems continue to shrink, there is a fundamental need to integrate more functionality into smaller spaces without compromising performance. This drives semiconductor manufacturers to develop more dense and integrated chip architectures. For instance, according to TSMC, in March 2023, its N3 process offered 60% to 70% higher logic density compared to its 5nm node, illustrating the continuous advancements in component integration. Concurrently, the growing demand for energy-efficient power solutions is a critical driver, fueled by environmental concerns, extended battery life requirements, and stringent regulatory standards. PSiP technology directly addresses this by integrating optimized power conversion circuitry, leading to improved efficiency and reduced power loss. Reflecting this emphasis on efficiency, Intel reported in June 2024 that its newly launched Intel Xeon 6 processors with Efficient-cores enabled performance per watt gains of up to 2.6 times compared to earlier generations, highlighting the ongoing industry focus on maximizing energy utility.

Download Free Sample Report

Key Market Challenges

The complexity of thermal management presents a notable challenge directly hampering the growth of the Global Power Supply In Package Chip Market. The dense integration inherent in Power Supply In Package (PSiP) designs generates high power densities within a confined space. This necessitates robust heat dissipation mechanisms to prevent overheating, which is critical for ensuring stable operational performance and extending device longevity. Developing effective thermal solutions adds significant layers of complexity to the design and engineering processes for PSiP products.

This thermal challenge directly translates into elevated initial development costs and extended design cycles for manufacturers. The intricate requirements for heat management demand specialized materials, advanced packaging techniques, and extensive validation testing, all of which consume considerable resources. In an already competitive semiconductor landscape, such increased overhead can impede innovation and market entry for new PSiP solutions. According to the Semiconductor Industry Association, global semiconductor sales experienced an 8.2% decrease in 2023 compared to 2022, totaling $526.8 billion. This broader market trend underscores how additional design complexities and costs, driven by factors like thermal management, can further constrain growth in specialized segments such as PSiP chips.

Key Market Trends

The adoption of wide bandgap (WBG) semiconductor materials, such as silicon carbide and gallium nitride, represents a pivotal trend reshaping the Global Power Supply In Package Chip Market. These materials enable devices to operate at higher voltages, temperatures, and frequencies than traditional silicon, directly leading to greater power density and improved energy efficiency within compact PSiP designs. The superior electrical properties of WBG semiconductors facilitate faster switching speeds and reduced power losses, which are critical for the demanding performance requirements of modern electronics. For instance, Wolfspeed's Mohawk Valley Fab contributed $78 million in revenue in the third quarter of fiscal year 2025, compared to $28 million in the third quarter of fiscal year 2024, demonstrating significant scaling in SiC production. This expansion underscores the increasing industry investment and confidence in WBG materials to power next-generation applications, from electric vehicles to renewable energy systems.

Another significant trend is the enhancement of in-package thermal management, which is essential for sustaining the performance and reliability of increasingly dense PSiP solutions. As power components integrate more closely, the localized heat generation intensifies, necessitating sophisticated heat dissipation strategies at the package level. Advances in materials and design, including optimized thermal interface materials and novel packaging architectures, are being developed to manage this heat effectively without compromising device footprint. Infineon Technologies AG, for example, showcased liquid-cooled high-density power supply solutions optimized for next-generation applications at the Applied Power Electronics Conference in February 2024, reflecting continued innovation in advanced power module thermal management. Such developments are crucial for preventing thermal breakdown and extending the operational lifespan of PSiP chips in high-performance environments.

Segmental Insights

In the Global Power Supply In Package Chip Market, the Power Supply on Chip (PwrSoC) segment is experiencing rapid growth. This accelerated expansion is primarily attributed to the pervasive industry trend towards miniaturization in electronic devices, such as portable electronics and Internet of Things solutions, where compact dimensions are paramount. PwrSoC technology integrates multiple power management functions directly onto a single chip or within a highly consolidated package, thereby significantly reducing the overall system footprint and simplifying design complexity. Furthermore, PwrSoC offers superior energy efficiency and improved thermal management, addressing critical requirements for extended battery life and reliable operation in increasingly dense electronic systems. This advanced integration also delivers enhanced performance and greater functionality, establishing PwrSoC as a preferred solution for modern power delivery.

Regional Insights

Asia Pacific emerges as the leading region in the global Power Supply In Package chip market due to its established semiconductor manufacturing infrastructure and a concentrated presence of global electronics manufacturers. The region benefits from a deeply integrated ecosystem, spanning design, fabrication, assembly, testing, and packaging services. Substantial government initiatives and ongoing investments in advanced packaging technologies by key countries like Taiwan, South Korea, China, and Japan, reinforce this dominance. This environment fosters the widespread demand for miniaturized power solutions across critical applications such as consumer electronics, automotive, and industrial sectors, driving continuous market growth.

Recent Developments

• In October 2025, Kaynes Semicon, operating from its Sanand facility, initiated the commercial rollout of India's first domestically packaged multi-chip modules (MCMs), which included intelligent power modules (IPMs). Approximately 900 of these IPMs were dispatched to Alpha & Omega Semiconductor (AOS) in California. These modules are engineered to consolidate components for controlling and safeguarding electrical flow, thereby enabling smoother, more efficient device operation, conserving space, and simplifying power management, representing a significant stride in the Global Power Supply In Package Chip Market.

• In November 2024, Flex Power Modules launched the BMR352, a new generation of non-isolated, fully regulated DC/DC converter. This product was designed to offer the market's highest peak power capability within a quarter-brick form factor. The BMR352's development underscores the continuous drive for enhanced power density and efficiency in integrated power solutions. It provides a compact power supply solution crucial for miniaturized power modules across various industrial and telecommunications applications within the Global Power Supply In Package Chip Market.

• In May 2024, Advanced Semiconductor Engineering (ASE) introduced powerSiP™, a new power delivery platform specifically designed for AI and data center applications. This innovative platform aims to significantly enhance power efficiencies by 50% through reducing signal and transmission loss. It integrates a vertically organized multi-stage voltage regulator module, resulting in a 25% smaller footprint compared to conventional side-by-side configurations. Additionally, powerSiP™ increases current density from 0.4 A/mm² to 0.6 A/mm², directly addressing critical density challenges in high-performance computing within the Global Power Supply In Package Chip Market.

• In May 2024, Texas Instruments unveiled a pioneering gallium nitride (GaN)-based intelligent power module (IPM) at PCIM Europe. This new product is engineered to serve power levels between 150 W and 250 W. The introduction of this GaN-based IPM signifies a notable advancement in power device technology, offering superior efficiency and a compact design. It consolidates essential power management functions into a single package, directly supporting the growing industry demand for smaller, more energy-efficient power solutions within the Global Power Supply In Package Chip Market.

Key Market Players

• Infineon Technologies AG
• Texas Instruments Incorporated
• Semiconductor Components Industries, LLC
• STMicroelectronics International N.V.
• Analog Devices, Inc.
• NXP Semiconductors N.V.
• Renesas Electronics Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• Lextar Electronics Corporation

Report Scope:

In this report, the Global Power Supply In Package Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Power Supply In Package Chip Market, By Product:

o   PSiP

o   PwrSoC

• Power Supply In Package Chip Market, By Application:

o   Telecom and IT

o   Automotive

o   Consumer Electronics

o   Medical Devices

o   Military & Defense

• Power Supply In Package Chip Market, By Region:

o   North America

§  United States

§  Canada

§  Mexico

o   Europe

§  France

§  United Kingdom

§  Italy

§  Germany

§  Spain

o   Asia Pacific

§  China

§  India

§  Japan

§  Australia

§  South Korea

o   South America

§  Brazil

§  Argentina

§  Colombia

o   Middle East & Africa

§  South Africa

§  Saudi Arabia

§  UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Power Supply In Package Chip Market.

Available Customizations:

Global Power Supply In Package Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Global Power Supply In Package Chip Market is an upcoming report to be released soon. If you wish an early delivery of this report or want to confirm the date of release, please contact us at [email protected]