Molded Interconnect Device Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Process (Laser Direct Structuring, Two-Shot Molding), By Application (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication, Others), By Region and Competition, 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 9.94 Billion
CAGR (2026-2031)	13.83%
Fastest Growing Segment	Two-Shot Molding
Largest Market	Asia Pacific
Market Size (2031)	USD 21.62 Billion

Market Overview

The Global Molded Interconnect Device Market will grow from USD 9.94 Billion in 2025 to USD 21.62 Billion by 2031 at a 13.83% CAGR. Molded Interconnect Devices (MIDs) are injection-molded thermoplastic components that incorporate integrated electronic circuit traces, effectively combining electrical and mechanical functions into a single unit. The global market for these devices is primarily driven by the increasing demand for miniaturization in electronics and the need to reduce assembly steps, which lowers production costs while enhancing reliability. This technology is seeing substantial traction in the automotive and medical sectors where space optimization and functional integration are essential. According to the Research Association 3-D MID e.V., in 2024, the specialized industrial network supporting this technology comprised 87 members, reflecting a consolidated ecosystem of manufacturers and research institutes dedicated to advancing MID applications.

One significant challenge that could impede market expansion is the high initial investment required for specialized injection molding tooling and laser structuring equipment. This financial barrier often makes the technology less viable for low-volume production runs compared to traditional printed circuit board assemblies, potentially limiting its widespread adoption to high-volume manufacturing scenarios where economies of scale can be fully realized.

Key Market Drivers

The rapid expansion of automotive electronics and electric vehicle architectures serves as a fundamental driver for the adoption of molded interconnect devices. Manufacturers increasingly utilize this technology to integrate circuits directly into structural components, which significantly reduces weight and eliminates bulky cabling within confined automotive interiors. This capability is particularly critical for accommodating the complex sensor arrays and control units required by modern electric mobility platforms without compromising spatial efficiency. According to the International Energy Agency, April 2024, in the 'Global EV Outlook 2024', electric car sales reached nearly 14 million in 2023, creating a massive requirement for these highly integrated electronic assemblies. Highlighting the industrial scale of the technology enabling this production, according to LPKF Laser & Electronics SE, in 2024, the company reported consolidated revenue of EUR 124.3 million for the prior fiscal year, underscoring the substantial capital investment in laser structuring systems.

Accelerated deployment of 5G telecommunications infrastructure further propels the market by necessitating antenna designs that traditional printed circuit boards cannot easily accommodate. Molded interconnects enable the fabrication of three-dimensional antenna structures directly onto the internal casing of smartphones and base stations, optimizing signal performance across multiple frequency bands without increasing the device footprint. This functional integration is essential for managing the multiple-input multiple-output configurations inherent in next-generation networks while maintaining the compact form factors consumers demand. According to Ericsson, June 2024, in the 'Ericsson Mobility Report', global 5G subscriptions grew by 160 million during the first quarter of 2024 alone to reach 1.7 billion, reflecting the intensifying pressure on component manufacturers to deliver these advanced connectivity solutions.

Download Free Sample Report

Key Market Challenges

The high initial investment required for specialized manufacturing infrastructure constitutes a significant barrier to the expansion of the Molded Interconnect Device market. Companies must commit substantial capital to acquire precision injection molding tools and laser direct structuring equipment before production can commence. This heavy financial outlay establishes a high break-even point, which renders the technology economically unviable for low-to-medium volume production runs. Consequently, the adoption of these devices is largely restricted to mass-market sectors like automotive and medical electronics, effectively excluding smaller enterprises and diverse lower-volume applications that cannot amortize the upfront costs through economies of scale.

The resource-intensive nature of this technology is further evidenced by the significant financial resources required to drive its advancement. According to the Research Association 3-D MID e.V., in 2024, the cumulative funding volume for research projects processed by the association amounted to approximately 176 million euros. This magnitude of investment underscores the financial complexity and high entry threshold characterizing the sector, directly limiting the market's ability to expand into cost-sensitive segments where traditional printed circuit boards remain a more financially prudent option.

Key Market Trends

The development of bio-compatible interconnects is reshaping the market for smart medical implants, driven by the critical need for miniaturization in patient-care devices. Manufacturers are increasingly leveraging molded interconnect devices to integrate complex circuitry directly into the housings of hearing aids, neuromodulation systems, and smart drug delivery units without compromising biocompatibility. This approach optimizes internal space and enhances device reliability by reducing the number of separate components required in strictly confined form factors. Reflecting the robust industrial activity supporting this healthcare sector, according to Cicor Group, July 2025, in the 'Half Year Report 2025', the company achieved net sales of CHF 280.7 million, driven by sustained demand in its core medical technology and industrial markets.

Concurrently, the emergence of Additively Manufactured Electronics (AME) is revolutionizing rapid prototyping by bypassing the high initial costs associated with traditional injection molding tools. This manufacturing innovation allows engineers to print dielectric structures and conductive traces simultaneously, enabling the fabrication of complex 3D circuits in hours rather than weeks. By eliminating the financial barrier of expensive tooling for low-volume runs, AME accelerates design iteration cycles and facilitates the agile development of customized electronic components. Highlighting the rapid commercial scaling of this digital production technology, according to Nano Dimension, September 2025, in the 'Nano Dimension Announces Financial Results for the Second Quarter 2025', revenue increased to USD 25.8 million, representing a 72.4% surge compared to the same period in the previous year.

Segmental Insights

Two-Shot Molding has emerged as the fastest-growing segment in the Global Molded Interconnect Device Market due to its distinct capacity for process consolidation and manufacturing efficiency. This method facilitates the integration of conductive and non-conductive materials into a single component, effectively eliminating the need for secondary assembly stages and reducing production costs. The segment is witnessing heightened adoption particularly within the automotive and medical industries, where the demand for robust, miniaturized electronic parts is paramount. By delivering improved mechanical stability and design versatility, Two-Shot Molding successfully meets the rising industrial requirement for reliable, space-saving interconnect solutions.

Regional Insights

Asia Pacific maintains a leading position in the Global Molded Interconnect Device market, driven by the strong concentration of electronics manufacturing services across the region. Countries such as China, Japan, and South Korea host significant production facilities for consumer electronics and automotive applications, creating high demand for integrated mechanical and electronic components. This dominance is further supported by the regional push toward miniaturization in telecommunication devices and medical equipment. The availability of raw materials and established supply chains allows local manufacturers to integrate molded circuits efficiently, solidifying the region as the central hub for market activity.

Recent Developments

• In March 2025, the HARTING Technology Group, a leading supplier of industrial connectivity, announced the development of a novel sensor carrier using 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology for a consumer electronics application. The company utilized this technology to create a miniaturized component that integrated both mechanical and electronic functions into a single three-dimensional unit, overcoming the space limitations of conventional printed circuit boards. By employing injection molding followed by laser direct structuring (LDS) and selective metallization, HARTING successfully produced a compact sensor solution that reduced assembly complexity and saved critical installation space within the device.
• In November 2024, LPKF Laser & Electronics SE showcased its latest advancements in Laser Direct Structuring (LDS) technology at the electronica trade fair in Munich. The company demonstrated its "WeLDS" process, which combines 3D-MID capabilities with laser plastic welding to enable the production of highly integrated, miniaturized electronic components. During the event, LPKF highlighted how this hybrid approach allows for the creation of conductive traces on injection-molded parts while ensuring durable, visually seamless joints for housing assemblies, thereby supporting the growing demand for compact electronics in automotive and industrial applications.
• In November 2024, TactoTek, a pioneer in In-Mold Structural Electronics (IMSE), secured $60 million in a funding round led by the Virala Group to accelerate the global adoption of its technology. The company, which operates within the broader molded interconnect device ecosystem, plans to use the investment to expand its operations and enhance its software-based delivery system for designing smart surface solutions. This funding aims to support the company's collaboration with major automotive and consumer electronics brands, facilitating the integration of electronic functions such as lighting and touch controls directly into 3D injection-molded plastic structures.
• In November 2024, the Cicor Group, a global provider of electronic solutions, announced its "Strategy 2028" which included the consolidation of its thin-film production capabilities to strengthen its Advanced Substrates Division. As part of this strategic update, the company emphasized its commitment to becoming the leading pan-European developer and manufacturer for high-tech electronics, including molded interconnect devices and hybrid circuits. The consolidation at its Wangs site in Switzerland was designed to optimize the production of sophisticated substrates and microelectronic assemblies, positioning the company to better serve the medical and aerospace sectors with miniaturized, high-reliability interconnect solutions.

Key Market Players

• Molex LLC
• TE Connectivity Ltd.
• Amphenol Corporation
• HARTING Technology Group
• KYOCERA AVX Components Corporation
• LPKF Laser & Electronics AG
• MID Solutions GmbH
• TEPROSA
• Taoglas
• RTP Company

By Process	By Application	By Region
Laser Direct Structuring Two-Shot Molding	Automotive Consumer Products Healthcare Industrial Military & Aerospace Telecommunication Others	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Molded Interconnect Device Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Molded Interconnect Device Market, By Process:

• Laser Direct Structuring
• Two-Shot Molding

• Molded Interconnect Device Market, By Application:

• Automotive
• Consumer Products
• Healthcare
• Industrial
• Military & Aerospace
• Telecommunication
• Others

• Molded Interconnect Device Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE