Integrated Passive Devices Market– Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Application (EMS & EMI Protection IPD, RF IPD, LED Lighting, Digital & Mixed Signal IPD), By End-use (Automobile, Consumer electronics, Healthcare, Others), By Region, By Competition, 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 2.26 Billion
CAGR (2026-2031)	9.01%
Fastest Growing Segment	Healthcare
Largest Market	Asia Pacific
Market Size (2031)	USD 3.79 Billion

Market Overview

The Global Integrated Passive Devices Market will grow from USD 2.26 Billion in 2025 to USD 3.79 Billion by 2031 at a 9.01% CAGR. Integrated Passive Devices (IPDs) are high-performance electronic components where passive elements such as resistors, capacitors, and inductors are fabricated directly into a semiconductor or glass substrate rather than being packaged as discrete units. This integration allows for significantly reduced footprints and enhanced electrical performance, addressing the fundamental industry requirements for miniaturization and signal integrity in high-frequency applications. The primary drivers fueling the expansion of this market include the escalating demand for compact consumer electronics and the rigorous performance needs of 5G telecommunications and advanced automotive systems, which require lower parasitic inductance compared to traditional surface-mount technologies.

The market's trajectory is closely linked to the broader semiconductor sector, which provides the essential platform for these integrated solutions. According to the Semiconductor Industry Association, global semiconductor sales reached $166.0 billion in the third quarter of 2024, an increase of 23.2% compared to the same period in 2023. This robust growth in the underlying semiconductor industry underscores the rising adoption of advanced component technologies like IPDs to support data-intensive applications. However, a significant challenge impeding widespread market expansion is the high initial non-recurring engineering cost and manufacturing complexity associated with IPDs, which can make them less cost-effective than standard discrete components for low-margin, high-volume applications.

Key Market Drivers

The rapid deployment of 5G telecommunications infrastructure serves as a primary catalyst for the adoption of Integrated Passive Devices (IPDs). As telecommunications providers transition to higher frequency bands, the necessity for components that maintain signal integrity while reducing parasitic capacitance becomes critical. IPDs allow for the integration of high-performance filters, couplers, and baluns directly onto substrates, which is essential for the efficient operation of modern radio frequency front-end modules used in massive MIMO implementations. According to Ericsson, June 2024, in the 'Ericsson Mobility Report', global 5G subscriptions grew by 160 million during the first quarter of 2024. This continued network expansion directly correlates to increased hardware requirements for both macro base stations and small cells, driving volume for integrated passive solutions that offer superior radio frequency performance compared to traditional discrete components.

Concurrently, the proliferation of connected wearables and miniaturized consumer electronics is accelerating market demand by imposing strict spatial constraints on device architecture. Manufacturers are increasingly utilizing System-in-Package technologies where passive components are embedded to conserve board space for larger batteries and processors. According to Apple Inc., August 2024, in the 'Fiscal Year 2024 Third Quarter Results', the Wearables, Home and Accessories segment generated net sales of $8.1 billion, reflecting the immense scale of component consumption in this sector. This demand for compact electronics is supported by a recovering manufacturing ecosystem; according to SEMI, in 2024, global silicon wafer shipments increased by 7.1% quarter-over-quarter in the second quarter. This rise in substrate availability is fundamental for the fabrication of IPDs, ensuring the supply chain can meet the volume needs of the consumer electronics market.

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Key Market Challenges

High non-recurring engineering expenses and complex manufacturing requirements present a substantial obstacle to the expansion of the Global Integrated Passive Devices Market. Unlike discrete components that utilize standard, low-cost production methods, integrated passive devices depend on advanced semiconductor fabrication techniques such as thin-film deposition and photolithography. This dependency necessitates significant upfront capital investment during the development phase, making the final unit cost considerably higher than traditional alternatives. Consequently, these elevated costs render integrated solutions less financially viable for price-sensitive or low-margin applications, effectively restricting their adoption to high-performance sectors.

The financial burden is further compounded by the significant operational costs associated with the necessary manufacturing infrastructure. The capital-intensive nature of maintaining such production environments directly impacts the pricing structure of these components. This high cost of operation is reflected in recent industry data regarding manufacturing expenditures. According to SEMI, in September 2024, worldwide semiconductor equipment billings totaled $26.8 billion for the second quarter of 2024. This magnitude of spending on production tooling highlights the heavy financial overhead that manufacturers face, which sustains the high entry barriers for integrated passive devices in mass-market segments.

Key Market Trends

The rising adoption of glass-based substrates for high-frequency RF and high-performance computing applications is fundamentally reshaping the technological landscape of the market. Glass offers superior dimensional stability and significantly lower electrical loss compared to traditional organic cores, properties that are essential for the dense interconnects required by next-generation AI accelerators and 5G/6G modules utilizing Through-Glass Via (TGV) technologies. This material shift is driving substantial industrial investment to establish the necessary manufacturing infrastructure for these advanced integrated solutions. According to the U.S. Department of Commerce, May 2024, in a press release regarding CHIPS Act incentives, Absolics was awarded up to $75 million to support the construction of a commercial facility in Georgia dedicated to the development of glass substrates for the semiconductor industry.

Simultaneously, the expansion of high-reliability IPD usage in automotive ADAS and electric vehicle systems is creating a critical new growth vector. As vehicle architectures increasingly rely on high-voltage powertrains and complex sensor arrays for autonomous driving, manufacturers are transitioning to integrated passive devices that can withstand extreme thermal cycles and mechanical vibrations better than discrete surface-mount components. This shift is directly supported by the rapid electrification of the global fleet, which necessitates robust, space-efficient components for safety-critical hardware. According to the International Energy Agency, April 2024, in the 'Global EV Outlook 2024', global electric car sales were projected to reach approximately 17 million units in 2024, underscoring the massive scale of demand for automotive-grade electronic components.

Segmental Insights

The Healthcare segment represents the most rapidly expanding area within the Global Integrated Passive Devices market, driven by the increasing demand for compact and reliable medical electronics. As the industry prioritizes portable patient monitoring systems and implantable solutions, manufacturers require components that enable significant miniaturization without compromising functionality. Integrated passive devices facilitate this reduction in size while maintaining the high stability required by strict regulatory frameworks established by organizations like the FDA. Consequently, the incorporation of these components into connected wearables and biosensors continues to accelerate to support modern digital health applications.

Regional Insights

Asia Pacific leads the Global Integrated Passive Devices Market due to the extensive presence of semiconductor manufacturing hubs in Taiwan, South Korea, China, and Japan. This regional dominance is driven by substantial production capacities and strong demand from the consumer electronics and automotive sectors. The rapid expansion of 5G telecommunications infrastructure further accelerates the adoption of these compact components for efficient signal management. Additionally, established supply chains and continuous industrial investment in semiconductor technologies enable high-volume manufacturing, firmly securing the position of Asia Pacific as the primary global supplier.

Recent Developments

• In November 2024, Murata Manufacturing Co., Ltd. expanded its capabilities in the Global Integrated Passive Devices Market by opening a new production line at its facility in Caen, France. This strategic development was designed to broaden the scope of the company's integrated passive solutions, specifically focusing on the mass production of advanced silicon capacitors. The manufacturing expansion included the deployment of a new 200-mm line, which utilized the company's latest passive integration connective substrate technology. This initiative aimed to meet the growing demand for high-performance, miniaturized components used in demanding applications such as implantable medical systems, telecommunication infrastructures, and mobile phones.
• In October 2024, Empower Semiconductor unveiled the Crescendo vertical power delivery platform, a breakthrough innovation that leveraged advanced silicon capacitor technology to address power density challenges in artificial intelligence and high-performance computing applications. The platform featured the company's proprietary FinFast technology, which integrated high-frequency magnetics and wide-bandwidth silicon capacitors into a thermally enhanced package. By eliminating the need for traditional external capacitor banks, this solution enabled true vertical power delivery directly to processors. This launch highlighted a significant advancement in the integration of passive components to improve system efficiency and transient response times in data center architectures.
• In October 2024, STMicroelectronics released the MLPF-WL-02D3, a new integrated passive device designed to optimize radio frequency performance for wireless microcontrollers. This component combined an impedance-matching network and a harmonic filter into a single chip-scale package, utilizing the company's proprietary integrated passive device technology on a non-conductive glass substrate. The release of this device was intended to simplify radio frequency circuit design by replacing multiple discrete components, thereby reducing the bill of materials and saving board space. This development underscored the company's focus on providing highly integrated, efficient solutions for the growing Internet of Things and wireless communication sectors.
• In June 2024, Johanson Technology introduced a new 900MHz directional radio frequency surface-mount coupler, expanding its portfolio of integrated passive components for wireless applications. This compact device, identified as P/N 0898CP14C0035001T, was engineered to operate within the 865 to 928 MHz frequency range, making it suitable for Internet of Things, cellular, and LoRa systems. The launch demonstrated the company's commitment to advancing integrated passive device technology by offering components that provide high isolation and low insertion loss in a miniature footprint. This product addressed the industry's increasing requirement for space-saving, high-reliability passive solutions in modern wireless electronic designs.

Key Market Players

• Murata Manufacturing Co., Ltd.
• Infineon Technologies AG
• STMicroelectronics N.V.
• ON Semiconductor Corporation
• Broadcom Inc.
• NXP Semiconductors N.V.
• Texas Instruments Incorporated
• Qorvo, Inc.
• MACOM Technology Solutions Holdings Inc.
• CTS Corporation

By Application	By End-use	By Region
EMS & EMI Protection IPD RF IPD LED Lighting Digital & Mixed Signal IPD	Automobile Consumer electronics Healthcare Others	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Integrated Passive Devices Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Integrated Passive Devices Market, By Application:

• EMS & EMI Protection IPD
• RF IPD
• LED Lighting
• Digital & Mixed Signal IPD

• Integrated Passive Devices Market, By End-use:

• Automobile
• Consumer electronics
• Healthcare
• Others

• Integrated Passive Devices Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE