In-Circuit Test Market – Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Type (Analog, Mixed), By Portability (Compact, Benchtop), By Application (Model Driven Architecture (MDA), In-circuit test (ICT), Fixtureless In-circuit Test (FICT)), By End User (Consumer Electronics, Aerospace, Defence & Government Services, Healthcare, Wireless Communication, Others), By Region, By Company and By Geography, Forecast & Opportunities, 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 917.04 Million
CAGR (2026-2031)	5.18%
Fastest Growing Segment	Mixed
Largest Market	Asia Pacific
Market Size (2031)	USD 1241.62 Million

Market Overview

The Global In-Circuit Test Market will grow from USD 917.04 Million in 2025 to USD 1241.62 Million by 2031 at a 5.18% CAGR. In-Circuit Test (ICT) systems are utilized in electronics manufacturing to verify the physical integrity and electrical functionality of printed circuit boards by isolating and testing individual components for manufacturing defects. The primary drivers fueling market expansion include the increasing complexity of electronic assemblies in the automotive and aerospace sectors, where high reliability is mandatory. Additionally, the widespread adoption of automated manufacturing lines necessitates high-throughput testing solutions to maintain production speed while ensuring rigorous quality control standards.

However, the market encounters a significant challenge due to the ongoing miniaturization of electronic components, which limits physical access for test probes and complicates fixture design. This reduction in board real estate forces manufacturers to balance test coverage with the rising costs of high-precision fixtures. This demand for quality assurance remains critical relative to production volumes; according to the Taiwan Printed Circuit Association, in 2024, the global PCB industry output was projected to climb to USD 78.2 billion, indicating a manufacturing landscape that necessitates robust defect detection.

Key Market Drivers

The rapid expansion of automotive electronics and electric vehicle manufacturing serves as a primary catalyst for the in-circuit test market. As the automotive industry transitions toward electrification and autonomy, the density of electronic control units and safety-critical printed circuit boards increases, making rigorous defect detection mandatory to ensure passenger safety and system reliability. ICT systems are essential for validating the complex interconnects within these high-voltage environments, detecting faults such as shorts, opens, or wrong components before final assembly. According to the International Energy Agency, April 2024, in the 'Global EV Outlook 2024', electric car sales were projected to reach approximately 17 million units in 2024, representing a robust sales growth that directly necessitates scalable and precise testing methodologies for automotive electronic components.

Concurrently, the deployment of 5G infrastructure and the subsequent demand for telecommunications equipment drive significant investment in advanced testing capabilities. The infrastructure required to support high-speed connectivity relies on dense, high-frequency circuit boards that demand precise electrical verification to maintain signal integrity and network uptime. Manufacturers utilize in-circuit testing to efficiently identify manufacturing defects in base stations and transmission hardware. According to Ericsson, June 2024, in the 'Ericsson Mobility Report', global 5G subscriptions increased by 160 million during the first quarter of 2024, highlighting the massive scale of hardware deployment required. Furthermore, this broad expansion in electronics production capacity reinforces the need for testing; according to SEMI, in 2024, global semiconductor manufacturing capacity was projected to increase by 6 percent, creating a substantial volume of electronic components requiring verification.

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Key Market Challenges

The ongoing miniaturization of electronic components presents a substantial barrier hampering the growth of the Global In-Circuit Test Market. As designs increasingly utilize High-Density Interconnect technologies, the physical space available for test pads drastically diminishes. This reduction prevents standard bed-of-nails fixtures from making necessary electrical contact, forcing manufacturers to invest in expensive custom fixtures or abandon ICT for alternative methods. Consequently, the rising cost and technical complexity of implementing ICT for densely packed boards directly reduce its appeal among cost-sensitive manufacturers.

This limitation creates a bottleneck relative to expanding manufacturing volumes. The market faces difficulty scaling to meet production surges because the testing infrastructure cannot easily accommodate compact designs. For instance, according to the IPC, in October 2025, North American PCB shipments surged by 24 percent compared to the same month in the previous year. While this uptick indicates robust industry output, the miniaturization challenge restricts the In-Circuit Test market from fully capitalizing on this demand, as the technology struggles to maintain efficiency with shrinking board geometries.

Key Market Trends

The Integration of AI and Machine Learning for Automated Fault Diagnosis is fundamentally reshaping test strategies by shifting from reactive defect detection to proactive process optimization. Manufacturers are increasingly deploying algorithms that analyze vast datasets of historical test results to identify subtle failure patterns and reduce false calls, thereby enhancing throughput and yield. This technological infusion enables ICT systems to self-adjust test parameters and isolate root causes of defects with unprecedented accuracy, minimizing the need for manual troubleshooting. The urgency of this adoption is evident in the manufacturing sector; according to Universal Robots, November 2024, in the 'Survey Insights: How Manufacturers are Embracing Technology in 2024' report, 48 percent of manufacturers were considering investing in AI and machine learning, underscoring the rapid pivot toward intelligent, data-driven quality control environments.

Simultaneously, there is a marked Shift Toward Compact and Modular Test System Architectures designed to address space constraints and scalability challenges in modern factories. Unlike traditional bulky testers, these modular units allow manufacturers to expand capacity incrementally by adding test cores, which is crucial for adapting to sudden production demand spikes without overhauling the entire floor plan. This need for scalable infrastructure is highlighted by recent industry metrics; according to the IPC, January 2025, in the 'North American PCB Statistical Program', North American PCB shipments surged 19.9 percent year-over-year, creating a pressure for flexible test floors that can rapidly accommodate increased throughput while maintaining efficiency.

Segmental Insights

The Mixed segment is currently emerging as the fastest-growing category within the Global In-Circuit Test Market. This expansion is primarily driven by the increasing prevalence of printed circuit board assemblies that integrate both analog and digital components. As industries such as automotive and consumer electronics adopt designs requiring dual-signal processing, the demand for test systems capable of verifying both signal types simultaneously has intensified. Consequently, manufacturers are prioritizing mixed-signal testing capabilities to ensure comprehensive fault detection and maintain high quality assurance standards across diverse electronic applications.

Regional Insights

Asia Pacific maintains the leading position in the global In-Circuit Test market, primarily driven by its established infrastructure for electronics manufacturing. Major production hubs in China, Taiwan, and Japan generate high volumes of printed circuit board assemblies for consumer electronics and the automotive sector. This intense manufacturing activity necessitates the widespread use of in-circuit testing to detect assembly defects and ensure compliance with quality standards. Consequently, the concentration of semiconductor and hardware production facilities in this region secures its dominance in demand for effective testing solutions.

Recent Developments

• In November 2025, Keysight Technologies launched the i7090 Massively Parallel and Scalable Board Test System, a breakthrough platform designed to address the challenges of high-volume printed circuit board assembly manufacturing. This next-generation system features a modular architecture capable of supporting up to 20 parallel test cores, which delivers substantial improvements in throughput and operational efficiency. The i7090 consolidates multiple testing methodologies, including in-circuit test (ICT), functional test, and flash programming, into a single unified station. This integration eliminates the need for multiple standalone testers, thereby reducing line complexity and floor space requirements while ensuring consistent test quality for sophisticated electronics.
• In February 2025, Digitaltest GmbH announced a strategic partnership with KABTEC AG to introduce a smart and compact inline testing solution for the electronics manufacturing market. This collaboration integrated Digitaltest's Sparrow MTS 30, a versatile 19-inch rack-based in-circuit and functional test system, into KABTEC's flexible test handler automation. The combined solution was engineered to provide high-throughput testing with a minimal factory footprint, supporting up to 1,152 test pins in its smallest configuration. By utilizing standard cassette fixtures compatible with both inline and offline systems, the joint offering allows manufacturers to streamline their production workflows and significantly reduce fixture debugging time.
• In May 2024, Test Research, Inc. (TRI) announced the opening of a new state-of-the-art research, development, and manufacturing facility in Taiwan to strengthen its position in the electronics inspection industry. This expansion was specifically designed to amplify the company's production capacity for its comprehensive portfolio, which includes High-Performance In-Circuit Testing (ICT) systems as well as optical and X-ray inspection solutions. The new facility features dedicated demonstration rooms and workshops, underscoring the company's commitment to developing advanced technologies for emerging sectors such as semiconductor and advanced packaging. This strategic move enables the company to meet the increasing testing requirements of complex future production lines.
• In January 2024, HIOKI E.E. CORPORATION achieved a significant operational milestone in the global in-circuit test market by flagging off the shipment of its first in-circuit tester manufactured outside of Japan. The company collaborated with a manufacturing partner in India to produce the FA1220-22 In-Circuit Tester, a system designed to deliver high-speed testing for populated circuit boards. This strategic development marked the beginning of a transformative journey for the company, combining Japanese precision with local manufacturing capabilities to serve the growing demand for electronic testing. The initiative was aimed at revolutionizing industries by ensuring enhanced efficiency, sustainability, and shortened delivery times for customers in the region.

Key Market Players

• Teradyne, Inc.
• Keysight Technologies, Inc.
• SPEA S.p.A.
• Advantest Corporation
• Chroma ATE, Inc.
• Mentor Graphics Corporation
• National Instruments Corporation
• Innovex Test Solutions AG
• Cirrus Logic, Inc.
• Viavi Solutions Inc.

By Type	By Portability	By Application	By End User	By Region
Analog Mixed	Compact Benchtop	Model Driven Architecture (MDA) In-circuit test (ICT) Fixtureless In-circuit Test (FICT)	Consumer Electronics Aerospace Defence & Government Services Healthcare Wireless Communication Others	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global In-Circuit Test Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• In-Circuit Test Market, By Type:

• Analog
• Mixed

• In-Circuit Test Market, By Portability:

• Compact
• Benchtop

• In-Circuit Test Market, By Application:

• Model Driven Architecture (MDA)
• In-circuit test (ICT)
• Fixtureless In-circuit Test (FICT)

• In-Circuit Test Market, By End User:

• Consumer Electronics
• Aerospace
• Defence & Government Services
• Healthcare
• Wireless Communication
• Others

• In-Circuit Test Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE