Next-Generation Lithography Materials Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Material (Photoresist, Ancillary Materials, Others), By Application (Automotive, Consumer Electronics, IT & Telecommunications, Others), By Region and Competition, 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 98.80 Million
CAGR (2026-2031)	4.26%
Fastest Growing Segment	Photoresist
Largest Market	Asia Pacific
Market Size (2031)	USD 126.91 Million

Market Overview

The Global Next-Generation Lithography Materials Market will grow from USD 98.80 Million in 2025 to USD 126.91 Million by 2031 at a 4.26% CAGR. Next-generation lithography materials comprise specialized chemical formulations, such as extreme ultraviolet photoresists, underlayers, and ancillary fluids, designed to facilitate semiconductor manufacturing at 7 nanometers and below. The primary driver for this market is the escalating demand for artificial intelligence and high-performance computing, which necessitates aggressive transistor miniaturization and increased density. These fundamental requirements compel chipmakers to seek materials with superior resolution and etch resistance to support physical scaling, a structural necessity distinct from temporary shifts in manufacturing preferences.

However, market expansion faces a significant challenge regarding the technical complexity of minimizing stochastic defects in extreme ultraviolet patterning, which can severely impact yield rates and increase ownership costs. This hurdle complicates the supply chain's ability to consistently deliver the defect-free, high-purity solutions essential for advanced node production. According to SEMI, in May 2024, global revenues for wafer fabrication materials, which include these critical lithography components, were reported to be $41.5 billion for the 2023 fiscal year.

Key Market Drivers

The accelerating adoption of extreme ultraviolet lithography acts as a transformative force for material formulations, as the transition to sub-7 nanometer nodes renders traditional argon fluoride chemistries insufficient. This shift compels suppliers to develop metal-oxide photoresists and robust underlayers capable of absorbing high-energy photons while mitigating stochastic defects, a technical requirement that fundamentally alters the composition of the supply chain. According to ASML, February 2024, in the 'Annual Report 2023', the company generated €9.1 billion in net sales from extreme ultraviolet systems, reflecting the massive industrial commitment to this patterning technology which directly dictates the consumption volume of compatible high-performance fluids.

Simultaneously, the strategic expansion of global wafer fabrication capacity serves as a volume-centric engine for market growth, driven by regional incentives to secure domestic semiconductor supply chains. As manufacturers bring new lines online to support logic and memory production, the aggregate consumption of lithography materials scales proportionally with the increased surface area processed. According to SEMI, June 2024, in the 'Quarterly World Fab Forecast', global semiconductor manufacturing capacity is projected to rise by 6 percent in 2024 to reach a record 33.7 million wafers per month. This physical expansion underscores the critical need for steady material flow, further evidenced by the recovery in substrate processing volumes; according to SEMI, in 2024, global silicon wafer shipments rose 7.1 percent quarter-over-quarter to 3,035 million square inches during the second quarter.

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Key Market Challenges

The technical complexity of minimizing stochastic defects in extreme ultraviolet patterning presents a formidable obstacle to the growth of the Global Next-Generation Lithography Materials Market. As semiconductor features shrink to support higher densities, these random, non-repeatable errors become increasingly frequent, directly reducing yield rates and inflating the total cost of ownership for chipmakers. This unpredictability strains the supply chain, as material providers struggle to consistently manufacture fluids and resists that can mitigate these random variations. Consequently, the inability to guarantee defect-free performance creates a bottleneck, delaying the mass adoption of these advanced materials and limiting the volume of orders from major semiconductor fabricators.

This operational inefficiency directly correlates to suppressed financial performance within the broader sector. According to SEMI, in April 2025, global wafer fabrication materials revenue increased 3.3% to $42.9 billion in 2024. While this figure reflects positive momentum, the growth rate is constrained by the lingering defectivity issues that force manufacturers to proceed cautiously with new material integration. Until these stochastic challenges are neutralized, the market cannot fully capitalize on the demand for high-performance computing, as the high costs associated with yield losses dampen the overall expenditure on these specialized lithography solutions.

Key Market Trends

The adoption of dry resist technologies constitutes a critical divergence from legacy wet chemistry, addressing the stochastic failures inherent in extreme ultraviolet lithography through a solvent-free deposition process. By utilizing chemical vapor deposition to apply photo-sensitive materials, this approach eliminates the viscosity-related instabilities of spin-coating, thereby enhancing resolution and reducing pattern collapse in high-numerical aperture applications. This technological validation was highlighted when the solution entered high-volume production; according to Lam Research, January 2025, in the press release 'Breakthrough EUV dry photoresist technology from Lam Research adopted by memory manufacturer', the company's Aether dry photoresist technology was selected by a leading memory manufacturer as the production tool of record for advanced DRAM processes, confirming the industrial scalability of solvent-free patterning.

Simultaneously, the proliferation of multi-layer material stacks is becoming essential to combat defectivity in advanced patterning, requiring the synchronous development of highly specialized ancillary fluids alongside core photoresists. As manufacturers push toward angstrom-scale nodes, the industry is shifting from single-layer chemistries to complex tri-layer systems involving robust hard masks and adhesion-promoting underlayers to maintain pattern fidelity during harsh etch steps. This structural evolution is driving rapid market expansion for auxiliary materials; according to SEMI, April 2025, in the report '2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue', the photoresist and photoresist ancillaries segments experienced strong double-digit growth, driven specifically by the increased processing complexity required for advanced DRAM and leading-edge logic integrated circuits.

Segmental Insights

The photoresist segment serves as the fastest growing category within the Global Next-Generation Lithography Materials Market, driven principally by the widespread adoption of Extreme Ultraviolet lithography. As semiconductor manufacturers transition toward smaller process nodes, they require advanced resist chemistries that ensure precise pattern transfer and structural stability on wafers. Standard materials are often insufficient for these reduced wavelengths, necessitating the development of specialized formulations with higher sensitivity. This critical reliance on improved chemical properties to support high-volume manufacturing of advanced logic and memory chips sustains the rapid expansion of the photoresist sector.

Regional Insights

Asia Pacific maintains a leading position in the Global Next-Generation Lithography Materials Market, primarily driven by its status as the central hub for global semiconductor manufacturing. The presence of major foundries, such as TSMC in Taiwan and Samsung Electronics in South Korea, creates immense demand for advanced photoresists and ancillary materials. This dominance is further supported by strategic government programs in China and Japan aimed at strengthening domestic integrated circuit supply chains. Furthermore, the extensive electronics manufacturing base within the region sustains a steady need for high-performance materials to support logic and memory chip production.

Recent Developments

• In January 2025, Lam Research Corporation announced that its innovative dry photoresist technology had been selected as the production tool of record by a leading memory manufacturer for advanced DRAM fabrication. The proprietary dry resist solution, developed in collaboration with key ecosystem partners, offered superior resolution and defectivity performance compared to traditional wet chemically amplified resists. This commercial adoption marked a pivotal shift in the global lithography materials market, validating the viability of dry processing for high-volume manufacturing of next-generation memory devices using extreme ultraviolet (EUV) lithography. The technology is expected to significantly reduce manufacturing costs while increasing yield.
• In October 2024, Fujifilm Corporation commenced the commercial sales of its newly developed negative-tone photoresists and developers designed specifically for extreme ultraviolet (EUV) lithography applications. The product launch featured a novel developer formulation engineered to minimize resist swelling, a critical factor for achieving high-resolution circuit patterns in advanced semiconductor nodes. To support this significant product rollout, the company also revealed comprehensive plans to enhance its production and quality evaluation capabilities at its existing facilities in Shizuoka, Japan, and Pyeongtaek, South Korea. This strategic release aimed to directly address the stringent performance requirements of next-generation chip manufacturing processes.
• In August 2024, Imec and ASML announced a significant breakthrough in the High-NA EUV lithography ecosystem at their joint laboratory in Veldhoven. The research center successfully printed circuit patterns with dimensions as small as 9.5 nanometers using the new high-numerical aperture system. This technical milestone involved the extensive validation of advanced lithography materials, including ultra-thin photoresists and underlayers specifically tailored for the high-NA process. The achievement effectively demonstrated the readiness of the broader material and equipment ecosystem to support the angstrom era of semiconductor manufacturing, paving the way for the production of faster and more energy-efficient chips.
• In April 2024, Shin-Etsu Chemical announced a strategic decision to construct a new manufacturing facility in Gunma Prefecture, Japan, specifically dedicated to semiconductor lithography materials. The company planned an investment of approximately ¥83 billion for the site, which was designated to become its fourth production base for these critical components. This major expansion aimed to meet the rapidly growing global demand for advanced materials, including photoresists for extreme ultraviolet (EUV) lithography, which are essential for cutting-edge chip production. The initiative highlighted the company's commitment to strengthening the supply chain and supporting the technological roadmap for next-generation semiconductor manufacturing.

Key Market Players

• Tokyo Ohka Kogyo Co., Ltd.
• JSR Corporation
• DuPont de Nemours, Inc.
• Shin-Etsu Chemical Co., Ltd
• Fujifilm Corporation
• Sumitomo Chemical Co., Ltd.
• Allresist GmbH
• micro resist technology GmbH
• DJ MicroLaminates, Inc.
• Merck KGaA

By Material	By Application	By Region
Photoresist Ancillary Materials Others	Automotive Consumer Electronics IT & Telecommunications Others	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Next-Generation Lithography Materials Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Next-Generation Lithography Materials Market, By Material:

• Photoresist
• Ancillary Materials
• Others

• Next-Generation Lithography Materials Market, By Application:

• Automotive
• Consumer Electronics
• IT & Telecommunications
• Others

• Next-Generation Lithography Materials Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE