Flexible Printed Circuit Board Market Size and Outlook 2031

Report Description

Forecast Period	2027-2031
Market Size (2025)	USD 37.56 Billion
CAGR (2026-2031)	10.76%
Fastest Growing Segment	Double-Sided FPCBs
Largest Market	North America
Market Size (2031)	USD 69.35 Billion

Market Overview

The Global Flexible Printed Circuit Board Market will grow from USD 37.56 Billion in 2025 to USD 69.35 Billion by 2031 at a 10.76% CAGR. Flexible Printed Circuit Boards are interconnects designed with conductive pathways on pliable substrates that allow for bending and folding within compact electronic devices. The primary drivers supporting market growth include the increasing necessity for lightweight and space-saving components in consumer electronics such as smartphones and wearables, as well as the expanding application of electronic systems in the automotive industry.

According to the Taiwan Printed Circuit Association, in 2024, the global flexible PCB market value reached USD 18.87 billion. Despite this growth, the market encounters a significant challenge regarding the volatility of raw material prices and supply chain uncertainties which can hinder production stability and impede broader market expansion.

Key Market Drivers

Rising demand for compact consumer electronics serves as a primary catalyst for the Global Flexible Printed Circuit Board Market. As smartphones, wearables, and foldable devices become increasingly sophisticated, manufacturers rely on Flexible Printed Circuit Boards (FPCs) to accommodate high-density interconnects within shrinking device footprints. The push for miniaturization requires circuits that can withstand repeated bending while maintaining signal integrity, particularly in critical components like display hinges and camera modules. This trend is evident in the financial performance of major component suppliers who cater to leading mobile brands. According to Zhen Ding Technology, August 2024, in the 'July 2024 Monthly Revenue Report', the company's Mobile Communication segment achieved double-digit year-over-year growth, driven substantially by the robust uptake of new consumer device models and advanced applications.

Accelerated adoption in electric and autonomous vehicles acts as the second critical driver, transforming the automotive sector into a high-growth avenue for FPC manufacturers. Modern electric vehicles (EVs) utilize flexible circuits extensively for Battery Management Systems (BMS) to monitor cell voltage and temperature, replacing heavy traditional wiring harnesses to reduce weight and improve range efficiency. Furthermore, the complexity of autonomous driving sensors necessitates the reliability that FPCs offer in harsh thermal environments. This shift is highlighted by significant industrial contracts; according to Nippon Mektron, April 2024, in a press release regarding new business with Volkswagen, the company secured orders expected to exceed 400 million euros to supply FPCs for the ID.2's battery systems starting in 2026. Reflecting this broader industry optimism, according to IPC, in 2024, electronics manufacturers anticipated PCB sales revenue to increase between 8 percent and 11 percent, underscoring the strong momentum across these key market sectors.

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Key Market Challenges

The volatility of raw material prices and supply chain uncertainties presents a formidable obstacle to the expansion of the Global Flexible Printed Circuit Board Market. Manufacturers rely heavily on essential materials such as copper, polyimide, and gold, and sudden price fluctuations can severely disrupt cost structures and erode profit margins. When supply chains become unpredictable, it becomes difficult for companies to maintain consistent production schedules or meet the stringent just-in-time delivery requirements of clients in the consumer electronics and automotive sectors. This instability forces manufacturers to operate cautiously, often delaying capacity expansions or adjusting pricing models, which can dampen overall market demand and impede broader industry growth.

The tangible impact of these disruptions is evident in recent industry performance metrics. According to IPC, in June 2025, North American PCB shipments decreased by 8.6 percent compared to the same month in the previous year. This decline highlights the direct consequence of market instability, where supply chain bottlenecks and economic fluctuations impede the ability of manufacturers to convert orders into finalized shipments. Such contractions in product movement demonstrate how these uncertainties actively constrain the market's growth potential despite the underlying demand from end-user applications.

Key Market Trends

The Shift Toward Liquid Crystal Polymer (LCP) for High-Frequency 5G Applications is redefining material standards to address signal integrity challenges in next-generation networks. As data transmission speeds accelerate into the millimeter-wave spectrum, traditional polyimide substrates face limitations regarding moisture absorption and insertion loss, prompting a mass migration toward LCP and Modified Polyimide (MPI) alternatives. This material evolution is quantitatively reflected in upstream manufacturing outputs. According to the Taiwan Printed Circuit Association, May 2025, in the 'Taiwan's PCB Industry Chain Is Expected to Grow Steadily' report, the total output value of PCB materials reached NTD 346.3 billion in 2024, marking a 13.4 percent annual increase attributed primarily to the surging demand for high-speed and low-loss substrate materials.

The Proliferation of Rigid-Flex Hybrid PCB Architectures is expanding beyond consumer devices into the critical aerospace and satellite communications sectors. This architectural approach, which eliminates fragile connectors by integrating flexible layers directly into rigid boards, provides the mechanical durability and weight reduction essential for equipment operating in high-vibration, zero-gravity environments. The rapid commercialization of Low Earth Orbit (LEO) satellite constellations has made this a high-growth segment. According to the Taiwan Printed Circuit Association, March 2025, in the 'Taiwan's PCB Industry Hits NT$816.8 Billion' report, the satellite PCB sector, which relies heavily on these complex hybrid interconnects, skyrocketed by 83 percent year-over-year in 2024 to reach a production value of NTD 19.3 billion.

Segmental Insights

The Double-Sided FPCBs segment is recognized as the fastest-growing category in the Global Flexible Printed Circuit Board Market, driven by the demand for higher circuit density in space-limited applications. These boards utilize conductive paths on both sides to enhance connectivity without significantly increasing thickness, making them essential for compact consumer electronics and automotive sensors. Their rapid expansion is propelled by their ability to offer improved signal transmission compared to single-sided options while remaining more cost-effective than multilayer alternatives. This balance of efficiency and affordability ensures their continued preference in high-volume manufacturing sectors.

Regional Insights

North America maintains a leading position in the Global Flexible Printed Circuit Board Market, driven by a robust technological ecosystem and high adoption of advanced electronic components. This dominance is supported by substantial investments in research and development and the concentration of major industry players within the United States. The sector benefits significantly from demand in aerospace and defense, where flexible circuits are essential for lightweight and high-reliability applications. Additionally, the continuous integration of these components into modern automotive and consumer electronic devices further solidifies the region's market authority.

Recent Developments

In June 2025, Mektec Corporation executed a major organizational restructuring by integrating its three German subsidiaries into a unified entity known as Mektec Europe GmbH. This strategic consolidation was undertaken to optimize business operations and strengthen the company's foothold in the competitive European flexible printed circuit board market. By centralizing its management and production resources, the firm aims to enhance its responsiveness to customers, particularly within the automotive sector which relies heavily on flexible interconnects. This integration represents a key step in the organization's global growth strategy to maintain its leadership in supplying advanced circuit solutions.
In October 2024, DuPont and Zhen Ding Technology Group finalized a strategic collaboration agreement aimed at advancing the technological capabilities of the global printed circuit board industry. This partnership focuses on the joint development of high-performance materials and manufacturing processes for next-generation flexible and rigid-flex circuits. The initiative combines specialized material science expertise with large-scale manufacturing proficiency to address emerging challenges in artificial intelligence and high-speed data transmission applications. Furthermore, the two companies committed to exploring sustainable production methods, intending to reduce the environmental impact of flexible circuit board fabrication while maintaining superior product quality.
In July 2024, Sumitomo Electric Industries announced a significant expansion of its flexible printed circuit board manufacturing operations with a $27.4 million investment in Hanoi, Vietnam. This strategic move involved the construction of additional facilities at its local subsidiary to boost production capacity for high-demand electronic components. The decision was driven by the rising global requirement for flexible circuits in smartphones, automotive applications, and other digital devices. Corporate management emphasized that increasing their production footprint in Southeast Asia would enhance supply chain stability and allow the company to better respond to the needs of its international customer base.
In February 2024, Cicor Technologies launched a new line of flexible printed circuit boards incorporating ultra-high density interconnect (HDI) technology to meet the rigorous demands of modern electronics. These innovative circuits feature exceptionally fine line widths and small vias, allowing for greater miniaturization and flexibility in complex device designs. The company targeted this development towards high-reliability sectors such as medical technology and aerospace, where reducing weight and saving space are essential. By enhancing their production capabilities with this advanced technology, the firm aimed to solidify its position as a leading provider of sophisticated interconnect solutions in the global market.

Key Market Players

Nippon Mektron, Ltd.
Multi-Fineline Electronix, Inc.
Flexible Circuit Technologies, Inc.
Fujikura Ltd.
Sumitomo Electric Industries, Ltd.
Zhen Ding Technology Holding Limited
Career Technology (MFG.) Co., Ltd.
Unimicron Technology Corporation
Flexium Interconnect, Inc.
Kingboard Holdings Limited

By Type	By End User	By Region
Single-Sided FPCBs Double-Sided FPCBs Multilayer FPCBs Rigid-Flex PCBs	Consumer Electronics Automotive Electronics Industrial Electronics	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Flexible Printed Circuit Board Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Flexible Printed Circuit Board Market, By Type:

Single-Sided FPCBs
Double-Sided FPCBs
Multilayer FPCBs
Rigid-Flex PCBs

Flexible Printed Circuit Board Market, By End User:

Consumer Electronics
Automotive Electronics
Industrial Electronics

Flexible Printed Circuit Board Market, By Region:

North America

United States
Canada
Mexico

Europe

France
United Kingdom
Italy
Germany
Spain

Asia Pacific

China
India
Japan
Australia
South Korea

South America

Brazil
Argentina
Colombia

Middle East & Africa

South Africa
Saudi Arabia
UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Flexible Printed Circuit Board Market.

Available Customizations:

Global Flexible Printed Circuit Board Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

Detailed analysis and profiling of additional market players (up to five).

Global Flexible Printed Circuit Board Market is an upcoming report to be released soon. If you wish an early delivery of this report or want to confirm the date of release, please contact us at [email protected]

Table of content

1. Product Overview

1.1. Market Definition

1.2. Scope of the Market

1.2.1. Markets Covered

1.2.2. Years Considered for Study

1.2.3. Key Market Segmentations

2. Research Methodology

2.1. Objective of the Study

2.2. Baseline Methodology

2.3. Key Industry Partners

2.4. Major Association and Secondary Sources

2.5. Forecasting Methodology

2.6. Data Triangulation & Validation

2.7. Assumptions and Limitations

3. Executive Summary

3.1. Overview of the Market

3.2. Overview of Key Market Segmentations

3.3. Overview of Key Market Players

3.4. Overview of Key Regions/Countries

3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Flexible Printed Circuit Board Market Outlook

5.1. Market Size & Forecast

5.1.1. By Value

5.2. Market Share & Forecast

5.2.1. By Type (Single-Sided FPCBs, Double-Sided FPCBs, Multilayer FPCBs, Rigid-Flex PCBs)

5.2.2. By End User (Consumer Electronics, Automotive Electronics, Industrial Electronics)

5.2.3. By Region

5.2.4. By Company (2025)

5.3. Market Map

6. North America Flexible Printed Circuit Board Market Outlook

6.1. Market Size & Forecast

6.1.1. By Value

6.2. Market Share & Forecast

6.2.1. By Type

6.2.2. By End User

6.2.3. By Country

6.3. North America: Country Analysis

6.3.1. United States Flexible Printed Circuit Board Market Outlook

6.3.1.1. Market Size & Forecast

6.3.1.1.1. By Value

6.3.1.2. Market Share & Forecast

6.3.1.2.1. By Type

6.3.1.2.2. By End User

6.3.2. Canada Flexible Printed Circuit Board Market Outlook

6.3.2.1. Market Size & Forecast

6.3.2.1.1. By Value

6.3.2.2. Market Share & Forecast

6.3.2.2.1. By Type

6.3.2.2.2. By End User

6.3.3. Mexico Flexible Printed Circuit Board Market Outlook

6.3.3.1. Market Size & Forecast

6.3.3.1.1. By Value

6.3.3.2. Market Share & Forecast

6.3.3.2.1. By Type

6.3.3.2.2. By End User

7. Europe Flexible Printed Circuit Board Market Outlook

7.1. Market Size & Forecast

7.1.1. By Value

7.2. Market Share & Forecast

7.2.1. By Type

7.2.2. By End User

7.2.3. By Country

7.3. Europe: Country Analysis

7.3.1. Germany Flexible Printed Circuit Board Market Outlook

7.3.1.1. Market Size & Forecast

7.3.1.1.1. By Value

7.3.1.2. Market Share & Forecast

7.3.1.2.1. By Type

7.3.1.2.2. By End User

7.3.2. France Flexible Printed Circuit Board Market Outlook

7.3.2.1. Market Size & Forecast

7.3.2.1.1. By Value

7.3.2.2. Market Share & Forecast

7.3.2.2.1. By Type

7.3.2.2.2. By End User

7.3.3. United Kingdom Flexible Printed Circuit Board Market Outlook

7.3.3.1. Market Size & Forecast

7.3.3.1.1. By Value

7.3.3.2. Market Share & Forecast

7.3.3.2.1. By Type

7.3.3.2.2. By End User

7.3.4. Italy Flexible Printed Circuit Board Market Outlook

7.3.4.1. Market Size & Forecast

7.3.4.1.1. By Value

7.3.4.2. Market Share & Forecast

7.3.4.2.1. By Type

7.3.4.2.2. By End User

7.3.5. Spain Flexible Printed Circuit Board Market Outlook

7.3.5.1. Market Size & Forecast

7.3.5.1.1. By Value

7.3.5.2. Market Share & Forecast

7.3.5.2.1. By Type

7.3.5.2.2. By End User

8. Asia Pacific Flexible Printed Circuit Board Market Outlook

8.1. Market Size & Forecast

8.1.1. By Value

8.2. Market Share & Forecast

8.2.1. By Type

8.2.2. By End User

8.2.3. By Country

8.3. Asia Pacific: Country Analysis

8.3.1. China Flexible Printed Circuit Board Market Outlook

8.3.1.1. Market Size & Forecast

8.3.1.1.1. By Value

8.3.1.2. Market Share & Forecast

8.3.1.2.1. By Type

8.3.1.2.2. By End User

8.3.2. India Flexible Printed Circuit Board Market Outlook

8.3.2.1. Market Size & Forecast

8.3.2.1.1. By Value

8.3.2.2. Market Share & Forecast

8.3.2.2.1. By Type

8.3.2.2.2. By End User

8.3.3. Japan Flexible Printed Circuit Board Market Outlook

8.3.3.1. Market Size & Forecast

8.3.3.1.1. By Value

8.3.3.2. Market Share & Forecast

8.3.3.2.1. By Type

8.3.3.2.2. By End User

8.3.4. South Korea Flexible Printed Circuit Board Market Outlook

8.3.4.1. Market Size & Forecast

8.3.4.1.1. By Value

8.3.4.2. Market Share & Forecast

8.3.4.2.1. By Type

8.3.4.2.2. By End User

8.3.5. Australia Flexible Printed Circuit Board Market Outlook

8.3.5.1. Market Size & Forecast

8.3.5.1.1. By Value

8.3.5.2. Market Share & Forecast

8.3.5.2.1. By Type

8.3.5.2.2. By End User

9. Middle East & Africa Flexible Printed Circuit Board Market Outlook

9.1. Market Size & Forecast

9.1.1. By Value

9.2. Market Share & Forecast

9.2.1. By Type

9.2.2. By End User

9.2.3. By Country

9.3. Middle East & Africa: Country Analysis

9.3.1. Saudi Arabia Flexible Printed Circuit Board Market Outlook

9.3.1.1. Market Size & Forecast

9.3.1.1.1. By Value

9.3.1.2. Market Share & Forecast

9.3.1.2.1. By Type

9.3.1.2.2. By End User

9.3.2. UAE Flexible Printed Circuit Board Market Outlook

9.3.2.1. Market Size & Forecast

9.3.2.1.1. By Value

9.3.2.2. Market Share & Forecast

9.3.2.2.1. By Type

9.3.2.2.2. By End User

9.3.3. South Africa Flexible Printed Circuit Board Market Outlook

9.3.3.1. Market Size & Forecast

9.3.3.1.1. By Value

9.3.3.2. Market Share & Forecast

9.3.3.2.1. By Type

9.3.3.2.2. By End User

10. South America Flexible Printed Circuit Board Market Outlook

10.1. Market Size & Forecast

10.1.1. By Value

10.2. Market Share & Forecast

10.2.1. By Type

10.2.2. By End User

10.2.3. By Country

10.3. South America: Country Analysis

10.3.1. Brazil Flexible Printed Circuit Board Market Outlook

10.3.1.1. Market Size & Forecast

10.3.1.1.1. By Value

10.3.1.2. Market Share & Forecast

10.3.1.2.1. By Type

10.3.1.2.2. By End User

10.3.2. Colombia Flexible Printed Circuit Board Market Outlook

10.3.2.1. Market Size & Forecast

10.3.2.1.1. By Value

10.3.2.2. Market Share & Forecast

10.3.2.2.1. By Type

10.3.2.2.2. By End User

10.3.3. Argentina Flexible Printed Circuit Board Market Outlook

10.3.3.1. Market Size & Forecast

10.3.3.1.1. By Value

10.3.3.2. Market Share & Forecast

10.3.3.2.1. By Type

10.3.3.2.2. By End User

11. Market Dynamics

11.1. Drivers

11.2. Challenges

12. Market Trends & Developments

12.1. Merger & Acquisition (If Any)

12.2. Product Launches (If Any)

12.3. Recent Developments

13. Global Flexible Printed Circuit Board Market: SWOT Analysis

14. Porter's Five Forces Analysis

14.1. Competition in the Industry

14.2. Potential of New Entrants

14.3. Power of Suppliers

14.4. Power of Customers

14.5. Threat of Substitute Products

15. Competitive Landscape

15.1. Nippon Mektron, Ltd.

15.1.1. Business Overview

15.1.2. Products & Services

15.1.3. Recent Developments

15.1.4. Key Personnel

15.1.5. SWOT Analysis

15.2. Multi-Fineline Electronix, Inc.

15.3. Flexible Circuit Technologies, Inc.

15.4. Fujikura Ltd.

15.5. Sumitomo Electric Industries, Ltd.

15.6. Zhen Ding Technology Holding Limited

15.7. Career Technology (MFG.) Co., Ltd.

15.8. Unimicron Technology Corporation

15.9. Flexium Interconnect, Inc.

15.10. Kingboard Holdings Limited

16. Strategic Recommendations

17. About Us & Disclaimer

Report Description

Table of content

Figures and Tables

Frequently asked questions

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