Global Extreme Ultraviolet (EUV) Lithography Market – Global Industry Size, Share, Trends, Opportunity, and Forecast Segmented by Technology Node (7nm and Below, 5nm, 3nm), By Component Type (Light Source (EUV Sources), Mirrors and Optics, Mask and Mask Handling Systems, Others), By End-Use Industry (Semiconductor Manufacturing, Integrated Device Manufacturers (IDMs), Foundries, Memory Manufacturers, Others), By Region, Competition 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 9.34 Billion
CAGR (2026-2031)	12.09%
Fastest Growing Segment	Integrated Device Manufacturers (IDMs)
Largest Market	Asia Pacific
Market Size (2031)	USD 18.52 Billion

Market Overview

The Global Extreme Ultraviolet (EUV) Lithography Market will grow from USD 9.34 Billion in 2025 to USD 18.52 Billion by 2031 at a 12.09% CAGR. Extreme Ultraviolet (EUV) Lithography is an advanced semiconductor manufacturing technology that utilizes light with a wavelength of 13.5 nanometers to print intricate circuit patterns on silicon wafers. The market is primarily propelled by the escalating demand for miniaturized, high-performance microchips essential for artificial intelligence, autonomous driving, and next-generation telecommunications. These applications necessitate advanced process nodes, specifically those below 7 nanometers, which rely on EUV capability to achieve higher transistor densities and improved energy efficiency. According to SEMI, in 2024, leading-edge capacity for 5nm nodes and under is expected to grow 13%, driven chiefly by generative artificial intelligence demands.

Despite this strong demand, a significant challenge impeding market expansion is the exorbitant capital expenditure and technical complexity associated with EUV systems. The implementation of these tools requires massive investment in equipment and specialized infrastructure, creating a substantial barrier to entry for many manufacturers. Additionally, the high operational costs, largely due to significant power consumption, combined with a highly consolidated supply chain, may slow the broader adoption of this technology across cost-sensitive semiconductor sectors.

Key Market Drivers

Surging Demand for High-Performance Computing and Artificial Intelligence Solutions is the primary catalyst accelerating the adoption of Extreme Ultraviolet Lithography, as the computational intensity of generative AI necessitates chip architectures with unprecedented transistor density. Semiconductor manufacturers are rapidly shifting production priorities to accommodate AI accelerators and High Bandwidth Memory (HBM), both of which require the precise critical dimensions that only EUV wavelengths can resolve. This pivot is quantitatively evidenced by foundry projections; according to TSMC, October 2025, the compound annual growth rate of sales from AI-related processors is expected to exceed 45% between 2024 and 2029, reflecting a long-term structural commitment to advanced node manufacturing.

Intensifying Capital Expenditure and Strategic Investments by Leading Foundries simultaneously drive market momentum, as the transition to sub-5nm and sub-2nm nodes mandates the procurement of high-cost lithography systems, including High-NA EUV tools. Major logic and memory chipmakers are executing aggressive roadmap accelerations, necessitating record-breaking budget allocations for fab equipment to ensure yield performance and technological leadership. According to SEMI, October 2025, global 300mm fab equipment spending is projected to surpass $100 billion for the first time in 2025, fueled by these capacity expansions. This investment directly translates to equipment orders, as ASML reported net bookings of €5.4 billion in its third-quarter 2025 results, highlighting the sustained procurement activity essential for next-generation semiconductor fabrication.

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Key Market Challenges

The exorbitant capital expenditure and technical complexity associated with EUV systems constitute a significant obstacle impeding the broader expansion of the Global Extreme Ultraviolet Lithography Market. These financial and technical barriers restrict the adoption of this technology to a limited number of well-capitalized semiconductor manufacturers capable of sustaining the massive initial outlay and ongoing operational costs. Consequently, this high barrier to entry prevents smaller foundries and cost-sensitive sectors from integrating EUV capabilities, thereby concentrating market power and limiting the overall volume of systems deployed globally.

The magnitude of the required financial commitment is evident in the industry's soaring equipment expenditures which reflects the intense capital intensity required to compete. According to SEMI, in 2025, global sales of semiconductor manufacturing equipment are forecast to reach a record $125.5 billion. This immense spending requirement underscores the difficulty for new or smaller players to enter the advanced manufacturing space, effectively slowing the rate at which EUV technology can proliferate beyond the leading-edge logic and memory segments.

Key Market Trends

The Transition to High-Numerical Aperture (High-NA) EUV Systems represents a critical technological evolution designed to overcome the resolution limits of current 0.33 NA tools. By increasing the numerical aperture to 0.55, these next-generation systems allow semiconductor manufacturers to print features with significantly higher contrast and reduced line-edge roughness, thereby eliminating the need for complex and costly double-patterning techniques at sub-2nm nodes. This technical leap is operationally validated by recent performance milestones; according to ASML, May 2024, at the 'ITF World 2024' conference, its High-NA EUV system successfully printed dense lines with a record resolution of 8 nanometers, confirming the optical capability required for future logic and memory scaling.

Simultaneously, the Expansion of EUV Lithography into DRAM Memory Manufacturing is reshaping the memory sector as producers aggressively integrate extreme ultraviolet layers to improve bit density and power efficiency in DDR5 and High Bandwidth Memory (HBM) stacks. While initial EUV adoption was concentrated in logic foundries, the technical stringency of advanced DRAM nodes—specifically the 1-gamma generation and beyond—has necessitated a broad strategic shift toward EUV to reduce process steps and enhance yield. This trend is exemplified by major industry players scaling their deployment; according to Micron, June 2024, in its 'Third Quarter 2024 Results' announcement, the company has progressed with the pilot production of its 1-gamma DRAM node using EUV technology and remains on track to implement high-volume manufacturing by 2025.

Segmental Insights

The Integrated Device Manufacturers (IDMs) segment is emerging as the fastest-growing category in the global Extreme Ultraviolet (EUV) lithography market due to a strategic renewed focus on internal manufacturing capabilities. These organizations are rapidly integrating EUV systems to achieve higher transistor densities for logic and memory components, thereby reducing reliance on external foundries. This vertical integration enables IDMs to align proprietary chip designs strictly with fabrication processes, enhancing final product efficiency. Consequently, the drive to secure supply chain independence and achieve technological leadership is propelling significant demand for EUV equipment within this sector.

Regional Insights

The Asia Pacific region maintains a dominant position in the global Extreme Ultraviolet lithography market due to the concentration of major semiconductor manufacturers in Taiwan, South Korea, and China. Industry leaders such as TSMC and Samsung Electronics drive substantial demand for EUV systems to facilitate high-volume production of advanced logic and memory chips. Furthermore, strategic government initiatives aimed at strengthening domestic semiconductor infrastructure create a supportive environment for equipment procurement. This established manufacturing ecosystem and continuous demand from the electronics sector confirm Asia Pacific as the primary hub for EUV technology.

Recent Developments

• In November 2025, ASML officially inaugurated its new Hwaseong Campus in Gyeonggi Province, South Korea, representing a significant investment of approximately ₩240 billion. The facility features a Repair and Reuse Center and an advanced training center dedicated to Extreme Ultraviolet (EUV) and Deep Ultraviolet (DUV) lithography technologies. The campus aims to strengthen collaboration with major local customers, such as Samsung Electronics and SK Hynix, by providing localized technical support and reducing equipment repair turnaround times. The center facilitates the transfer of technical expertise and enhances the stability of the regional semiconductor supply chain.
• In September 2025, SK Hynix installed its first High NA EUV lithography system, the ASML TWINSCAN EXE:5200B, at its M16 fabrication plant in Icheon, South Korea. The company announced the successful assembly of this equipment, which is designed for volume production with a 0.55 numerical aperture. This installation enables the manufacturer to print transistors with significantly higher density compared to standard EUV tools. The semiconductor firm plans to utilize this technology to accelerate the development of next-generation memory products, aiming to enhance performance and cost competitiveness in the high-bandwidth memory market.
• In June 2024, ASML and imec announced the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, establishing a collaborative facility for the global semiconductor ecosystem. This laboratory provides logic and memory chip manufacturers, along with materials and equipment suppliers, access to the prototype High NA EUV scanner, the TWINSCAN EXE:5000. The initiative allows companies to de-risk the technology and develop private use cases before the scanners are operational in their own production fabs. The facility also supports the development of advanced photoresists, photomasks, and metrology techniques required for the 0.55 numerical aperture tools.
• In April 2024, Intel Foundry completed the assembly of the industry's first commercial High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography system at its research and development facility in Hillsboro, Oregon. The tool, a TWINSCAN EXE:5000 manufactured by ASML, marked a significant technical milestone by enabling the printing of features 1.7 times smaller than those possible with existing equipment. This capability supports the company's roadmap for advanced process nodes beyond the 18A generation. The complex installation process involved calibrating the optical and mechanical components to ensure the necessary precision for future commercial chip production and process development.

Key Market Players

• ASML Holding NV.
• CARL ZEISS AG.
• Toppan Photomasks Inc
• USHIO, INC
• NTT ADVANCED TECHNOLOGY CORPORATION.
• KLA CORPORATION
• ADVANTEST CORPORATION
• Photronics, Inc
• HOYA Corporation
• Trumpf

By Component Type	By End-Use Industry	By Region
Light Source (EUV Sources) Mirrors and Optics Mask and Mask Handling Systems Others	Semiconductor Manufacturing Integrated Device Manufacturers (IDMs) Foundries Memory Manufacturers Others	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Extreme Ultraviolet (EUV) Lithography Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Extreme Ultraviolet (EUV) Lithography Market, By Component Type:

• Light Source (EUV Sources)
• Mirrors and Optics
• Mask and Mask Handling Systems
• Others

• Extreme Ultraviolet (EUV) Lithography Market, By End-Use Industry:

• Semiconductor Manufacturing
• Integrated Device Manufacturers (IDMs)
• Foundries
• Memory Manufacturers
• Others

• Extreme Ultraviolet (EUV) Lithography Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE