Electronic Adhesives Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Resin Type (Epoxy, Silicone, Polyurethane, Acrylic, Others), By Form (Liquid, Paste, Solid), By Product Type (Electrically Conductive Adhesives, Thermally Conductive Adhesives, Others), By End User Industry (Consumer Electronics, Medical, Industrial, Transportation, Aerospace & Defense, Others), By company and By Region 2021-2031F

Forecast Period	2027-2031
Market Size (2025)	USD 5.27 Billion
CAGR (2026-2031)	7.71%
Fastest Growing Segment	Epoxy
Largest Market	North America
Market Size (2031)	USD 8.23 Billion

Market Overview

The Global Electronic Adhesives Market will grow from USD 5.27 Billion in 2025 to USD 8.23 Billion by 2031 at a 7.71% CAGR. Electronic adhesives are specialized materials designed to form durable structural bonds between components while providing critical functions such as electrical conductivity, thermal management, and environmental isolation within electronic assemblies. The market is primarily driven by the relentless miniaturization of consumer devices, the global expansion of 5G telecommunications infrastructure, and the electrification of the automotive sector, all of which necessitate high-performance bonding solutions for dense circuitry. According to SEMI, in 2024, global sales of semiconductor packaging materials—a sector heavily reliant on advanced adhesive technologies—grew by 4.7% to USD 24.6 billion, underscoring the robust industrial demand for these essential materials.

Despite this growth, the market encounters a significant challenge in the volatility of raw material prices, particularly for silver and epoxy resins, which can unpredictably escalate manufacturing costs. This financial instability is often compounded by stringent environmental regulations regarding volatile organic compounds, which compel manufacturers to invest heavily in compliant reformulations, potentially impeding rapid market expansion and complicating supply chain dynamics.

Key Market Drivers

The rapid expansion of electric vehicles and advanced driver-assistance systems serves as a primary catalyst for the electronic adhesives market, creating substantial demand for materials that ensure thermal management and structural durability. Manufacturers increasingly rely on specialized adhesive formulations to bond battery cells, seal sensors, and protect power electronics from harsh operating conditions while maintaining electrical insulation. This shift from internal combustion engines to electrified powertrains requires bonding solutions that withstand high voltages and thermal cycling, fundamentally reshaping material consumption patterns in the automotive sector. According to the International Energy Agency, April 2024, in the 'Global EV Outlook 2024', sales of electric cars across the globe were projected to reach nearly 17 million units in 2024, indicating a massive surge in production requirements for automotive electronic assemblies.

Accelerating miniaturization of electronic devices and components further propels market trajectory as manufacturers seek adhesives that support dense circuitry and heterogeneous integration. As devices become smaller yet more powerful, the industry requires underfills and conductive adhesives that offer precise application and effective heat dissipation for compact semiconductor packaging. According to the Semiconductor Industry Association, November 2024, in the 'September 2024 Global Semiconductor Sales' update, the global semiconductor industry posted sales of USD 55.3 billion for the month of September 2024, reflecting the intense component output requiring advanced bonding technologies. This industrial scale is evident in corporate performance, where leading material suppliers continue to report significant turnover. According to Henkel, in 2024, its Adhesive Technologies business unit achieved sales of 2.8 billion Euros during the third quarter alone, highlighting the sustained commercial value of bonding agents in modern manufacturing.

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Key Market Challenges

The primary constraint impeding the expansion of the Global Electronic Adhesives Market is the volatility of raw material prices, specifically regarding essential inputs like silver and epoxy resins. These materials are fundamental to the production of high-performance conductive and structural adhesives. When the costs of these commodities fluctuate unpredictably, adhesive manufacturers face immediate pressure on production overheads. This financial instability disrupts long-term pricing strategies and erodes profit margins, making it difficult for suppliers to guarantee consistent costs to electronics manufacturers. Consequently, this uncertainty slows down the adoption of advanced bonding solutions in cost-sensitive mass production environments.

This economic challenge is intensified by a persistent imbalance between the soaring industrial appetite for conductive metals and their available supply. According to the Silver Institute, in 2024, global industrial demand for silver rose by 4 percent to a record 680.5 million ounces, contributing to a significant structural market deficit. Such a distinct shortage in a primary raw material directly restricts the scalability of conductive adhesive manufacturing. As raw material availability tightens and costs escalate, the market struggles to meet the high-volume requirements of emerging sectors without incurring prohibitive expenses, thereby hampering overall market growth.

Key Market Trends

The transition toward sustainable and bio-based adhesive formulations is reshaping the market as manufacturers prioritize environmental responsibility. Suppliers are replacing fossil-based ingredients with renewable alternatives to lower carbon footprints without compromising performance. This shift is driven by stringent ESG targets from OEMs demanding transparency and reduced emissions. According to Henkel, March 2025, in the 'Sustainability Report 2024', the company achieved a reduction of CO2 emissions in production per ton of product by 64 percent compared to the base year 2017, illustrating the commitment to decarbonizing chemical manufacturing.

Simultaneously, the integration of adhesives in flexible and foldable electronic devices creates demand for materials offering exceptional mechanical flexibility. Unlike rigid solutions, these adhesives must withstand repeated bending and thermal stress while maintaining integrity in OLED displays and foldable smartphones. This trend drives investment in infrastructure to support the production of bendable components. According to Samsung Electronics, January 2025, in the 'Fourth Quarter and FY 2024 Results' report, the company invested KRW 4.8 trillion in capital expenditures for its Display division during 2024, underscoring the financial commitment to advancing high-performance panel technologies.

Segmental Insights

Based on recent market intelligence, the Epoxy segment is projected to register the fastest growth within the Global Electronic Adhesives Market. This expansion is primarily driven by the material's superior thermal stability and high chemical resistance, which are critical for encapsulation and potting applications in the semiconductor industry. As the automotive sector accelerates its shift toward electric vehicles, there is a surging demand for robust adhesives capable of protecting power electronics from harsh environmental stress. Consequently, manufacturers are increasingly adopting epoxy-based solutions to ensure the structural integrity and operational reliability of miniaturized electronic components.

Regional Insights

North America leads the global electronic adhesives market due to extensive manufacturing activities within the semiconductor and automotive sectors. The region benefits from a well-established industrial base that requires reliable bonding materials for circuit assembly and component protection. Furthermore, stringency from regulatory bodies like the Environmental Protection Agency regarding volatile organic compounds drives the adoption of compliant, eco-friendly adhesive technologies. This combination of industrial demand and regulatory pressure supports the continuous expansion of the market across the United States and Canada.

Recent Developments

• In September 2025, Henkel celebrated the completion of a significant expansion at its manufacturing facility in Brandon, South Dakota, reinforcing its supply capabilities for the Global Electronic Adhesives Market. The facility upgrade, representing an investment of approximately $30 million, installed advanced mixing equipment to increase the production of thermal management materials and adhesives used in electric vehicles and electronic devices. This expansion was designed to meet the growing demand for high-performance materials that ensure the safety and durability of complex electronic systems. The project underscores the company's strategy to localize production and enhance support for electronics manufacturers in North America.
• In February 2025, LG Chem announced a strategic collaboration with HL Mando to co-develop advanced adhesive solutions for next-generation automotive electronic components. This partnership focuses on creating high-performance thermal gap fillers and insulating adhesives tailored for advanced driver assistance systems, including cameras and radar sensors. The initiative aims to expand the company's influence in the Global Electronic Adhesives Market by addressing the rigorous thermal management and reliability standards required for software-defined vehicles. By leveraging joint expertise in material science and automotive parts, the collaboration seeks to mass-produce these specialized electronic adhesive materials by 2026.
• In September 2024, Panacol introduced a new electrically conductive adhesive specifically designed for flexible electronic applications within the Global Electronic Adhesives Market. The product, identified as Elecolit 3648, is a solvent-free, one-component epoxy resin formulated to cure at low temperatures, which is critical for processing heat-sensitive substrates like those used in organic photovoltaics and perovskite solar cells. This innovation addresses the industry's need for conductive materials that maintain integrity under mechanical stress, offering a reliable alternative to traditional soldering in flexible electronics. The launch highlights the company's focus on developing specialized solutions for emerging electronic form factors.
• In September 2024, DELO Industrial Adhesives launched a specialized adhesive capable of creating ultra-fine structures to support the miniaturization of microelectronic components. The new material, DELO DUALBOND EG4797, enables the precise dispensing of narrow micro-dams on printed circuit boards, which serve as flow stops for liquid encapsulants in heterogeneous integration processes. This development is significant for the Global Electronic Adhesives Market as it allows manufacturers to optimize package layouts and reduce space requirements on crowded electronic assemblies. The adhesive features a dual-curing mechanism, utilizing both light and heat to ensure rapid and reliable processing in high-volume semiconductor manufacturing.

Key Market Players

• Dymax Corporation
• Henkel AG & Co KGaA
• H.B. Fuller Company
• 3M Company
• Evonik Industries AG
• Dow Corning
• Alent Plc
• BASF SE
• The DOW Chemical Co.
• H.B. Fuller

By Resin Type	By Form	By Product Type	By End User Industry	By Region
Epoxy Silicone Polyurethane Acrylic Others	Liquid Paste Solid	Electrically Conductive Adhesives Thermally Conductive Adhesives Others	Consumer Electronics Medical Industrial Transportation Aerospace & Defense Others	North America Europe Asia Pacific South America Middle East & Africa

Report Scope:

In this report, the Global Electronic Adhesives Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

• Electronic Adhesives Market, By Resin Type:

• Epoxy
• Silicone
• Polyurethane
• Acrylic
• Others

• Electronic Adhesives Market, By Form:

• Liquid
• Paste
• Solid

• Electronic Adhesives Market, By Product Type:

• Electrically Conductive Adhesives
• Thermally Conductive Adhesives
• Others

• Electronic Adhesives Market, By End User Industry:

• Consumer Electronics
• Medical
• Industrial
• Transportation
• Aerospace & Defense
• Others

• Electronic Adhesives Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE