India LED Packaging Market is projected to witness growth at a robust CAGR, during 2018-23, owing to the increasing government initiatives in the adoption of energy saving and cost affective LEDs in residential areas as well as offices to save energy. Moreover, the rising need of smart-lighting solutions in end-use industries and growing demand of LEDs in display panels in televisions, mobiles etc will drive the India LED Packaging Market further. Based on the applications, automotive lightning segment is anticipated to occupy the largest market share in the forecast period due to the growing adoption of LEDs in the new ages car in internal as well as external lighting. Based on package type segment of the LED Packaging market, Chip Scale Package (CSP) is predicted to lead the market in the next five years, due to its advantages like thinner profile, compact packaging, reduced weight and better performance over others.

 

Years considered for this report:

Historical Years: 2013-2016

Base Year: 2017

Estimated Year: 2018

Forecast Period: 2018–2023

Objective of the Study:

  • To analyse and forecast the market size of India LED Packaging Market, in terms of value.
  • To classify and forecast India LED Packaging Market based on package type, packaging material, applications and regional distribution.
  • To identify drivers and challenges for India LED Packaging Market.
  • To examine competitive developments such as expansions, mergers & acquisitions, etc., in India LED Packaging Market.
  • To conduct the pricing analysis for India LED Packaging Market.
  • To identify and analyse the profile of leading players involved in the manufacturing of India LED Packaging Market.

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Some of the leading players in the India LED Packaging market are Samsung, LG Innotek, Phillips, Stanley Electric, Seoul Semiconductor, Osram, Nichia, Epistar, Lumileds, Kulicke & Soffa etc.

TechSci Research performed both primary as well as exhaustive secondary research for this study. Initially, TechSci Research sourced a list of manufacturers in India. Subsequently, TechSci Research conducted primary research surveys with the identified companies. While interviewing, the respondents were also enquired about their competitors. Through this technique, TechSci Research could include the manufacturers which could not be identified due to the limitations of secondary research. TechSci Research analysed the components, types, business functions, deployment models, distribution channels and presence of all major manufacturers in India.

TechSci Research calculated the market size of India LED Packaging using a bottom-up approach, where value sales data for LED Packaging market was recorded and forecast for the future years. TechSci Research sourced these values from the industry experts and company representatives and externally validated through analysing historical data of these product types and applications for getting an appropriate, overall market size. Various secondary sources such as company website, news articles, press releases, company annual reports, investor presentations and financial reports were also used by TechSci Research.


Key Target Audience:

  • LED Packaging Providers.
  • Raw Material Suppliers.
  • Distributors and Traders of LED materials.
  • Manufacturing Equipment Providers.
  • Research Organizations and Consulting Companies.
  • Market Research and Consulting firms.

The study is useful in providing answers to several critical questions that are important for the industry stakeholders such as manufacturers, partners, end users, etc., besides allowing them in strategizing investments and capitalizing on market opportunities.

Report Scope:

In this report, India LED Packaging market has been segmented into following categories, in addition to the industry trends which have also been detailed below:

  • Market, By Package Type:
    • Surface Mount Device Package (SMD)
    • Chip on Board Package (COB)
    • Chip Scale Package (CSP)
    • Others
  • Market, By Packaging Material:
    • Lead Frames
    • Substrates
      • Silicon Carbide
      • Silicon
      • Sapphire
    • Ceramic Packages
      • LEDs With Sintered Ceramic Package
      • LEDs With Ceramic Substrate and Silicon
      • LEDs With Ceramic Substrate and Glass
    • Bonding Wire
    • Encapsulation Resins
    • Other Packaging Materials
  • Market, By Applications:
    • General Lighting
      • Residential Lighting
      • Industrial Lighting
      • Outdoor Lighting
      • Other General Lighting
    • Automotive Lighting
      • Interior Lighting
      • Exterior Lighting
    • Backlighting
    • Other Applications
  • Market, by Region:
    • North Region
    • South Region
    • East Region
    • West Region

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in LED Packaging Market.

Available Customizations:

With the given market data, TechSci Research offers customizations according the company’s specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Profit Margin Analysis

  • Profit margin analysis in case of direct and indirect sales channel.

In case you don’t find what you are looking for, please get in touch with our custom research team at sales@techsciresearch.com

It is an upcoming report to be released soon. If you wish an early delivery of this report or want to confirm the date of release, please contact us at sales@techsciresearch.com  

In case you don’t find what you are looking for, please get in touch with our custom research team at sales@techsciresearch.com

1.    Product Overview

2.    Research Methodology

3.    Executive Summary

4.    Voice of Customers

4.1.  Vendor Satisfaction

4.2.  Vendor Challenges

4.3.  Overall Satisfaction Analysis

5.    India LED Packaging Market Landscape

6.    India LED Packaging Market Outlook

6.1.  Market Size & Forecast

6.1.1.     By Value

6.2.  Market Share & Forecast

6.2.1.     By Package Type (Chip Scale Package (CSP), Surface Mount Device Package (SMD), Chip on Board Package (COB) and Others)

6.2.2.     By Packaging Material (Lead Frames, Substrates, Ceramic Packages, Bonding Wire, Encapsulation Resins and Other Packaging Materials)

6.2.3.     By Applications (General Lighting, Automotive Lighting, Backlighting and Other Applications)

6.2.4.     By Company

6.2.5.     By Region

6.3.  Market Attractiveness Index

7.    India Chip Scale Package Market Outlook

7.1.  Market Size & Forecast

7.1.1.     By Value

7.2.  Market Share & Forecast

7.2.1.     By Packaging Material

7.2.2.     By Applications

8.    India Surface Mount Device Package Market Outlook

8.1.  Market Size & Forecast

8.1.1.     By Value

8.2.  Market Share & Forecast

8.2.1.     By Packaging Material

8.2.2.     By Applications

9.    India Chip on Board Package Market Outlook

9.1.  Market Size & Forecast

9.1.1.     By Value

9.2.  Market Share & Forecast

9.2.1.     By Packaging Material

9.2.2.     By Applications

10.  Market Dynamics

10.1.              Drivers

10.2.              Challenges

11.  Market Trends & Developments

12.  Supply Chain Analysis

13.  Policy & Regulatory

14.  India Economic Profile

15.  Competitive Landscape

16. Strategic Recommendations

In case you don’t find what you are looking for, please get in touch with our custom research team at sales@techsciresearch.com