Semiconductor Manufacturing Equipment Market to be Dominated by 3D Packaging Technology through 2028
Increase in demand for electronic devices and rising adoption of
cloud-based solutions to drive the Global Semiconductor Manufacturing Equipment
market in the forecast period.
According to
TechSci Research report, “Semiconductor Manufacturing Equipment Market –
Global Industry Size, Share, Trends, Opportunity, and Forecast, 2018-2028F,” the Global Semiconductor
Manufacturing Equipment Market has grown significantly in recent years, and
this trend is projected to continue in the coming years. Consumer gadgets like
smartphones, tablets, and laptops are driving the industry, as is the rising
acceptance of new technologies such as artificial intelligence, the Internet of
Things (IoT), and 5G networks. Semiconductor Manufacturing Equipment are
electronic components that utilize the electronic characteristics of
semiconductor materials such as silicon, germanium, organic semiconductors, and
gallium arsenide to make semiconductor devices or integrated circuits. Semiconductor
Manufacturing Equipment is a massive piece of machinery that consists of
numerous step procedures that manufacture semiconductor components. Semiconductor
Manufacturing Equipment is used to assure the assembly of semiconductor parts,
the fabrication of wafers, and the testing of the complete device.
Global usage of consumer
electronic devices such as notebooks, laptops, smartphones, games, and
wearables are driving market expansion during the next five years. The
increased use of the internet of things in key industrial verticals is fueling
demand for linked devices and sensors to enable optimal communication and
reaction amongst devices. The advancement of the telecommunications industry,
as well as the anticipated roll-out of 5G technology to boost connectivity and
provide fast internet access throughout the world, are likely to fuel the global
semiconductor manufacturing equipment market growth over the forecast period.
The rise of cutting-edge technologies such as the internet of things,
artificial intelligence, cloud computing, and big data analytics is likely to
open up lucrative potential for the global semiconductor manufacturing
equipment market growth. The rise in the demand for faster and advanced memory
chips for industrial applications and the use of technologies to process large
amounts of data in minimal time significantly contribute to the market growth.
Browse over XX market data
Figures spread through XX Pages and an in-depth TOC on the "Semiconductor Manufacturing Equipment Market"
The Semiconductor
Manufacturing Equipment Market can be segmented by equipment type, dimension,
supply chain process, region and competitive landscape.
On the basis of
Equipment Type, the market is segmented into Front-end Equipment and Back-end Equipment.
The semiconductor front-end equipment segment is anticipated to increase at the
fastest rate among equipment type throughout the projected period. Wafer
processing equipment, fabrication facilities and automation equipment, masking
equipment, and wafer manufacturing equipment are all included in the front-end
equipment. Wafer processing equipment typically consists of devices that carry
out heat processing, ion implant, lithography, surface preparation, deposition,
etching, and inspection. Automatic testing, process diagnostic, assembly, and
packaging equipment are all included at the back end.
On the basis of
Dimension, the market is segmented into 2D, 2.5D and 3D. The 3D packaging technology is going to dominate
this segment. With chipmakers under increasing pressure to fulfil rising demand
for chipsets, IC manufacturers are stepping up attempts to enhance output by
using innovative chip packaging technologies such as 3D ICs. Technological
developments enable chipmakers to provide circuits with small footprints and
great performance at reduced costs. Manufacturers of
semiconductor memory devices are now able to take advantage of 3D packaging to
reduce the footprint of their wafers and memory storage devices, while
simultaneously increasing storage capacity.
On the basis of Supply Chain Process, the
market is further split into Outsourced Semiconductor Assembly and Test
(OSAT), Integrated Device
Manufacturer (IDM) and Foundry. The outsourced semiconductor assembly
and test (OSAT) supply chain process segment is predicted to develop through
2028, owing to the use of assembly, packaging, and testing services by consumer
electronics and automotive manufacturers.
OSAT enterprises are
looking for automated machinery and equipment to integrate into their manufacturing
facilities, allowing clients to outsource semiconductor and electronic devices.
The increased requirement to maximize semiconductor fab time and capacity is
encouraging OSAT participation to assure a speedier and consistent supply of
semiconductors.
Key market players in the Global
Semiconductor Manufacturing Equipment Market include:
- Applied Materials Inc
- ASML Holding Semiconductor Company
- Tokyo Electron Limited
- Lam Research Corporation
- KLA Corporation
- Veeco Instruments Inc
- Screen Holdings Co. Ltd
- Teradyne Inc
- Hitachi High -Technologies Corporation
- Ferrotec Holdings Corporation.
Download Free Sample Report
Customers can also request
10% free customization on this report.
“The global semiconductor
manufacturing equipment market is expected to witness significant growth in the
near future. The increasing demand for consumer electronics, rising demand for
automated systems, and advancements in technology are some of the major factors
driving the market. Additionally, the growing need for miniaturization of
electronic components, increasing demand for high performance computing, and
the increasing demand for smart devices are expected to further propel the
market growth. Moreover, the increasing demand for high-end components in the
automotive industry is another factor driving the market.”.
said Mr. Karan Chechi, Research Director with TechSci Research, a research-based
global management consulting firm.
“Semiconductor Manufacturing Equipment Market –
Global Industry Size, Share, Trends, Opportunity, and Forecast, 2018-2028F, Segmented By Equipment
Type (Front-end Equipment ((Lithography Equipment, Etching Equipment,
Deposition Equipment, Metrology/Inspection Equipment, Material Removal/Cleaning
Equipment, Photoresist Processing Equipment) and Back-end Equipment (Wafer
Manufacturing Equipment, Assembly & Packaging Equipment, Test Equipment)), By
Dimension (2D, 2.5D and 3D), By Supply Chain Process (Outsourced Semiconductor
Assembly and Test (OSAT), Integrated Device Manufacturer (IDM), Foundry), By
Region, Competition,” has evaluated the future
growth potential of Semiconductor Manufacturing Equipment Market and provides
statistics and information on market structure, size, share, and future growth.
The report intends to provide cutting-edge market intelligence and help
decision makers take sound investment decisions. Besides, the report also
identifies and analyzes the emerging trends along with essential drivers, challenges,
and opportunities in the Global Semiconductor Manufacturing Equipment market.
Contact
Mr. Ken Mathews
708 Third Avenue,
Manhattan, NY,
New York – 10017
Tel: +1-646-360-1656
Email: [email protected]
Website: https://www.techsciresearch.com